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參數資料
| 型號： | WEDPS512K32V-20BC |
| 廠商： | MICROSEMI CORP-PMG MICROELECTRONICS |
| 元件分類： | SRAM |
| 英文描述： | 512K X 32 MULTI DEVICE SRAM MODULE, 20 ns, PBGA143 |
| 封裝： | 16 X 18 MM, PLASTIC, BGA-143 |
| 文件頁數： | 2/7頁 |
| 文件大?。?/td> | 126K |
| 代理商： | WEDPS512K32V-20BC |
2
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
WEDPS512K32V-XBX
White Electronic Designs
CAPACITANCE
(TA = +25°C)
Parameter
Symbol
Conditions
Max Unit
OE capacitance
COE
VIN = 0 V, f = 1.0 MHz
30
pF
WE1-4 capacitance
CWE
VIN = 0 V, f = 1.0 MHz
10
pF
CS1-4 capacitance
CCS
VIN = 0 V, f = 1.0 MHz
10
pF
Data I/O capacitance
CI/O
VI/O = 0 V, f = 1.0 MHz
10
pF
Addressinputcapacitance
CAD
VIN = 0 V, f = 1.0 MHz
30
pF
This parameter is guaranteed by design but not tested.
TRUTH TABLE
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Min
Max
Unit
Operating Temperature
TA
-55
+125
°C
Storage Temperature
TSTG
-65
+150
°C
Signal Voltage Relative to GND
VG
-0.5
4.6
V
Junction Temperature
TJ
150
°C
Supply Voltage
VCC
-0.5
4.6
V
CS
OE
WE
Mode
Data I/O
Power
H
X
Standby
High Z
Standby
L
H
Read
Data Out
Active
L
X
L
Write
Data In
Active
L
H
Out Disable
High Z
Active
RECOMMENDED OPERATING CONDITIONS
Parameter
Symbol
Min
Max
Unit
Supply Voltage
VCC
3.0
3.6
V
Input High Voltage
VIH
2.2
VCC + 0.3
V
Input Low Voltage
VIL
-0.3
+0.8
V
DC CHARACTERISTICS
(VCC = 3.3V ± 0.3V, TA = -55°C to +125°C)
Parameter
Sym
Conditions
Units
Min
Max
Input Leakage Current
ILI
VIN = GND to VCC
10
A
Output Leakage Current
ILO
CS = VIH, OE = VIH, VOUT = GND to VCC
10
A
Operating Supply Current (x 32 Mode)
ICC x 32
CS = VIL, OE = VIH, f = 5MHz, VCC = 3.6V
400
mA
StandbyCurrent
ISB
CS = VIH, OE = VIH, f = 5MHz, VCC = 3.6V
120
mA
Output Low Voltage
VOL
IOL = 4.0mA
0.4
V
Output High Voltage
VOH
IOH = -4.0mA
2.4
V
NOTE: DC test conditions: VIH = VCC -0.3V, VIL = 0.3V.
NOTE: Contact factory for low power option.
BGA THERMAL RESISTANCE
Description
Symbol
Max
Unit
Notes
Junction to Ambient (No Airflow)
Theta JA
16.9
°C/W
1
Junction to Ball
Theta JB
11.3
°C/W
1
Junction to Case (Top)
Theta JC
9.8
°C/W
1
NOTE:
Refer to Application Note "PBGA Thermal Resistance Correlation" at
www.whiteedc.com in the application notes section for modeling conditions.
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相關代理商/技術參數 |
參數描述 |
|---|---|
| WEDPS512K32V-XBX | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:SRAM MCP |
| WEDPS512K32-XBX | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512Kx32 SRAM MULTI-CHIP PACKAGE |
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| WEDPY256K72V-100BI | 制造商:White Electronic Designs 功能描述:SRAM Module Synchronous 18Mbit 制造商:White Electronic Designs 功能描述:256K X 72 SSRAM MODULE, 3.3V, 100MHZ, 159 BGA 14MM X 22MM, I - Bulk |
| WEDPY256K72V-100BM | 制造商:Microsemi Corporation 功能描述:256K X 72 SSRAM MODULE, 3.3V, 100MHZ, 159 BGA 14MM X 22MM, M - Bulk |
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