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參數(shù)資料
| 型號： | WEDPZ512K72S-133BC |
| 廠商： | WHITE ELECTRONIC DESIGNS CORP |
| 元件分類： | SRAM |
| 英文描述： | 512K X 72 MULTI DEVICE SRAM MODULE, 4.2 ns, PBGA152 |
| 封裝： | 17 X 23 MM, PLASTIC, BGA-152 |
| 文件頁數(shù)： | 7/15頁 |
| 文件大?。?/td> | 433K |
| 代理商： | WEDPZ512K72S-133BC |
WEDPZ512K72S-XBX
15
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
PRELIMINARY*
White Electronic Designs Corp. reserves the right to change products or specications without notice.
November 2003
Rev. 6
Document Title
512K x 72 Synchronous SRAM – NBL
Revision History
Rev #
History
Release Date
Status
Rev 0
Initial Release
February 2001
Advanced
Rev 1
Changes (Pg. 1, 5, 6, 13)
1.1 Block Diagram: Change DQD to DQPD, Font Consistency
1.2 Electrical Characteristics Note 2: Change reference to mA instead of MA.
1.3 DC Characteristics: Adjust location of Units & Notes for ISB2.
1.4 AC Characteristics: Change temperature range to (-55°C ≤ TA ≤ +125°C)
1.5 Package Dimension: Adjust length line to end of package
1.6 Block Diagram: Adjust look for consistency
1.7 DC Characteristics: ISB2 condition should read All Inputs ≤ VIL or ≥ VIH instead of > VIH
1.8 Figure 2: Inputs transition should not be shown fully connected.
1.9 Figure 6: Unknown text deleted from timing diagram
1.10 Package Dimension: Ball diameter arrow corrected to point to ball.
April 2001
Advanced
Rev 2
Change (Pg. 1)
1.1 Change status from Advanced to Preliminary
November 2001
Preliminary
Rev 3
Changes (Pg. 1, 2)
1.1 Block Diagram: Address lines should be A0-18
1.2 Pin Conguration: Add Note *Pin F8 reserved for A19 upgrade to 1Mx72.
November 2001
Preliminary
Rev 4
Changes (Pg. 1, 5)
1.1 BGA Capacitance: Remove references to temperature in individual conditions
1.2 Change CI from 10pF to 8pF
1.3 Change CA from 20pF to 16pF
1.4 Change CCK from 7pF to 6pF
1.5 Add Control Input Capacitance (CIC) 16pF
November 2002
Preliminary
Rev 5
Changes (Pg. 5)
1.1 Add Thermal Resistance table
1.2 Update current values
1.3 Update package mechanical drawing
May 2003
Preliminary
Rev 6
Changes (Pg. 1, 13, 14, 15)
1.1 Change mechanical drawing to new style
November 2003
Preliminary
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| WEDPZ512K72S-133BI | 制造商:Microsemi Corporation 功能描述:512K X 72 ZBL SSRAM MODULE, 2.5V, 133MHZ, 152 BGA 17MM X 23M - Bulk |
| WEDPZ512K72S-133BM | 制造商:Microsemi Corporation 功能描述:512K X 72 ZBL SSRAM MODULE, 2.5V, 133MHZ, 152 BGA 17MM X 23M - Bulk |
| WEDPZ512K72S-150BC | 制造商:Microsemi Corporation 功能描述:512K X 72 ZBL SSRAM MODULE, 2.5V, 150MHZ, 152 BGA 17MM X 23M - Bulk |
| WEDPZ512K72S-150BI | 制造商:Microsemi Corporation 功能描述:512K X 72 ZBL SSRAM MODULE, 2.5V, 150MHZ, 152 BGA 17MM X 23M - Bulk |
| WEDPZ512K72S-150BM | 制造商:Microsemi Corporation 功能描述:512K X 72 ZBL SSRAM MODULE, 2.5V, 150MHZ, 152 BGA 17MM X 23M - Bulk |
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