參數(shù)資料
型號: WS1M32-17H2CA
廠商: MICROSEMI CORP-PMG MICROELECTRONICS
元件分類: SRAM
英文描述: 1M X 32 MULTI DEVICE SRAM MODULE, 17 ns, CPGA66
封裝: 1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66
文件頁數(shù): 7/8頁
文件大?。?/td> 328K
代理商: WS1M32-17H2CA
WS1M32-XXX
7
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
White Electronic Designs Corp. reserves the right to change products or specications without notice.
July, 2002
Rev. 4
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
84 LEAD, CERAMIC QUAD FLAT PACK (G3)
0.38 (0.015)
± 0.05 (0.002)
4.12 (0.162) ± 0.20 (0.008)
1.27 (0.050) TYP
29.11 (1.146)
± 0.25 (0.010)
25.40 (1.000) TYP
4.29 (0.169)
± 0.28 (0.011)
0.19 (0.008)
± 0.06 (0.003)
1.02 (0.040)
± 0.12 (0.005)
0.25 (0.010)
± 0.03 (0.002)
1 / 7
R 0.127
(0.005) MIN
DETAIL A
SEE DETAIL "A"
Pin 1
0.27 (0.011)
± 0.04 (0.001)
+
30.23 (1.190) ± 0.25 (0.010) SQ
27.18 (1.070) ± 0.25 (0.010) SQ
The WEDC 84 lead G3 CQFP lls the same t and function as the JEDEC 84 lead CQFJ
or 84 PLCC. But the G3 has the TCE and lead inspection advantage of the CQFP form.
1.146"
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