參數(shù)資料
型號: WS1M32-17H2CA
廠商: MICROSEMI CORP-PMG MICROELECTRONICS
元件分類: SRAM
英文描述: 1M X 32 MULTI DEVICE SRAM MODULE, 17 ns, CPGA66
封裝: 1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66
文件頁數(shù): 8/8頁
文件大?。?/td> 328K
代理商: WS1M32-17H2CA
WS1M32-XXX
8
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
White Electronic Designs Corp. reserves the right to change products or specications without notice.
July, 2002
Rev. 4
ORDERING INFORMATION
LEAD FINISH:
Blank = Gold plated leads
A
=
Solder dip leads
DEVICE GRADE:
M
=
Military Screened
-55°C to +125°C
I
=
Industrial
-40°C to +85°C
C
=
Commercial
0°C to +70°C
PACKAGE TYPE:
H2 = Ceramic Hex-In-line Package, HIP (Package 402)*
G3 = 28 mm Ceramic Quad Flatpack, CQFP (Package 511)
ACCESS TIME (ns)
ORGANIZATION, two banks of 512Kx32
User congurable as 2Mx16 or 4Mx8
SRAM
WHITE ELECTRONIC DESIGNS CORP.
W S 1M32 - XX X X X
* Package to be developed.
相關(guān)PDF資料
PDF描述
WF128K64-150G4WC5 1M X 8 FLASH 5V PROM MODULE, 150 ns, CQMA116
WF4M16-120DTC5A 4M X 16 FLASH 5V PROM MODULE, 120 ns, CDSO56
WF512K32N-70H1Q5 512K X 32 FLASH 5V PROM MODULE, 70 ns, CPGA66
WS128K32-45G4TCE 512K X 8 MULTI DEVICE SRAM MODULE, 45 ns, CQFP68
W3H128M72E2-667NBI 128M X 72 DDR DRAM, 0.5 ns, PBGA208
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
WS1M32-17HSC 制造商:未知廠家 制造商全稱:未知廠家 功能描述:1Mx32 SRAM MODULE
WS1M32-17HSCA 制造商:未知廠家 制造商全稱:未知廠家 功能描述:1Mx32 SRAM MODULE
WS1M32-17HSI 制造商:未知廠家 制造商全稱:未知廠家 功能描述:1Mx32 SRAM MODULE
WS1M32-17HSIA 制造商:未知廠家 制造商全稱:未知廠家 功能描述:1Mx32 SRAM MODULE
WS1M32-17HSM 制造商:未知廠家 制造商全稱:未知廠家 功能描述:1Mx32 SRAM MODULE