3
FN8108.1
May 17, 2006
X28HC256S-12*
X28HC256S-12
120
0 to +70
28 Ld SOIC (300 mils)
MDP0027
X28HC256SZ-12 (Note)
X28HC256S-12 Z
0 to +70
28 Ld SOIC (300 mils) (Pb-free)
MDP0027
X28HC256SI-12*
X28HC256SI-12
-40 to +85
28 Ld SOIC (300 mils)
MDP0027
X28HC256SIZ-12 (Note)
X28HC256SI-12 Z
-40 to +85
28 Ld SOIC (300 mils) (Pb-free)
MDP0027
X28HC256SM-12*
X28HC256SM-12
-55 to +125
28 Ld SOIC (300 mils)
MDP0027
X28HC256D-90
X28HC256D-90
90
0 to +70
28 Ld CERDIP (520 mils)
X28HC256DI-90
X28HC256DI-90
-40 to +85
28 Ld CERDIP (520 mils)
X28HC256DM-90
X28HC256DM-90
-55 to +125
28 Ld CERDIP (520 mils)
X28HC256DMB-90
X28HC256DMB-90
MIL-STD-883
28 Ld CERDIP (520 mils)
X28HC256EM-90
X28HC256EM-90
-55 to +125
32 Ld LCC (458 mils)
X28HC256EMB-90
X28HC256EMB-90
MIL-STD-883
32 Ld LCC (458 mils)
X28HC256FI-90
X28HC256FI-90
-40 to +85
28 Ld FLATPACK (440 mils)
X28HC256FM-90
X28HC256FM-90
-55 to +125
28 Ld FLATPACK (440 mils)
X28HC256FMB-90
X28HC256FMB-90
MIL-STD-883
28 Ld FLATPACK (440 mils)
X28HC256J-90*
X28HC256J-90
0 to +70
32 Ld PLCC
N32.45x55
X28HC256JZ-90* (Note)
X28HC256J-90 Z
0 to +70
32 Ld PLCC (Pb-free)
N32.45x55
X28HC256JI-90*
X28HC256JI-90
-40 to +85
32 Ld PLCC
N32.45x55
X28HC256JIZ-90* (Note)
X28HC256JI-90 Z
-40 to +85
32 Ld PLCC (Pb-free)
N32.45x55
X28HC256JM-90*
X28HC256JM-90
-55 to +125
32 Ld PLCC
N32.45x55
X28HC256KM-90
X28HC256KM-90
-55 to +125
28 Ld PGA
G28.550x650A
X28HC256KMB-90
X28HC256KMB-90
MIL-STD-883
28 Ld PGA
G28.550x650A
X28HC256P-90
X28HC256P-90
0 to +70
28 Ld PDIP
E28.6
X28HC256PZ-90 (Note)
X28HC256P-90 Z
0 to +70
28 Ld PDIP (Pb-free)**
E28.6
X28HC256PI-90
X28HC256PI-90
-40 to +85
28 Ld PDIP
E28.6
X28HC256PIZ-90 (Note)
X28HC256PI-90 Z
-40 to +85
28 Ld PDIP (Pb-free)**
E28.6
X28HC256S-90*
X28HC256S-90
0 to +70
28 Ld SOIC (300 mils)
MDP0027
X28HC256SI-90*
X28HC256SI-90
-40 to +85
28 Ld SOIC (300 mils)
MDP0027
X28HC256SIZ-90 (Note)
X28HC256SI-90 Z
-40 to +85
28 Ld SOIC (300 mils) (Pb-free)
MDP0027
X28HC256DMB-70
X28HC256DMB-70
70
MIL-STD-883
28 Ld CERDIP (520 mils)
X28HC256JI-20
X28HC256JI-20
200
-40 to +85
32 Ld PLCC
N32.45x55
X28HC256SI-20T1
200
-40 to +85
28 Ld SOIC (300 mils) Tape and Reel
MDP0027
*Add "T1" suffix for tape and reel.
**Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications.
NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate
termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
Ordering Information
(Continued)
PART NUMBER
PART MARKING
ACCESS TIME
(ns)
TEMP. RANGE
(°C)
PACKAGE
PKG. DWG. #
X28HC256