參數(shù)資料
型號(hào): x76f102
元件分類: FLASH
英文描述: 4 Mbit Uniform Sector, Serial Flash Memory
中文描述: 4兆位統(tǒng)一部門,串行閃存
文件頁數(shù): 18/18頁
文件大?。?/td> 104K
代理商: X76F102
X76F102
18
ORDERING INFORMATION
V
CC
Limits
Blank = 5V ±10%
2.0 = 2.0V to 5.5V
Temperature Range
Blank = Commercial = 0°C to +70°C
I = Industrial= –40°C to +85°C
Package
S8 = 8-Lead SOIC
M8 = 8-Lead MSOP
P = 8-Lead PDIP
V8 - 8-Lead TSSOP
H = Die in Waffle Packs
W = Die in Wafer Form
X = Smart Card Module
Device
X76F102
X
X
–X
Part Mark Convention
8-Lead MSOP
ACG = 2.0 to 5.5V, 0 to +70°C
ACH = 2.0 to 5.5V, -40 to +85°C
ABS = 4.5 to 5.5V, 0 to +70°C
ABT = 4.5 to 5.5V, -40 to +85°C
EYWW
XXX
8-Lead SOIC/PDIP
X76F102 X
XX
Blank = 8-Lead SOIC
F = 2.0 to 5.5V, 0 to +70°C
G = 2.0 to 5.5V, -40 to +85°C
Blank = 4.5 to 5.5V, 0 to +70°C
I = 4.5 to 5.5V, -40 to +85°C
LIMITED WARRANTY
Devices sold by Xicor, Inc. are covered by the warranty and patent indemnification provisions appearing in its Terms of
Sale only. Xicor, Inc. makes no warranty, express, statutory, implied, or by description regarding the information set forth
herein or regarding the freedom of the described devices from patent infringement. Xicor, Inc. makes no warranty of
merchantability or fitness for any purpose. Xicor, Inc. reserves the right to discontinue production and change specifica-
tions and prices at any time and without notice.
Xicor, Inc. assumes no responsibility for the use of any circuitry other than circuitry embodied in a Xicor, Inc. product. No
other circuits, patents, licenses are implied.
U.S. PATENTS
Xicor products are covered by one or more of the following U.S. Patents: 4,263,664; 4,274,012; 4,300,212; 4,314,265;
4,326,134; 4,393,481; 4,404,475; 4,450,402; 4,486,769; 4,488,060; 4,520,461; 4,533,846; 4,599,706; 4,617,652;
4,668,932; 4,752,912; 4,829, 482; 4,874, 967; 4,883, 976. Foreign patents and additional patents pending.
LIFE RELATED POLICY
In situations where semiconductor component failure may endanger life, system designers using this product should
design the system with appropriate error detection and correction, redundancy and back-up features to prevent such an
occurence.
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