參數(shù)資料
型號: XB1004
廠商: MIMIX BROADBAND INC
元件分類: 衰減器
英文描述: 16.0-30.0 GHz GaAs MMIC Buffer Amplifier
中文描述: 16000 MHz - 30000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
封裝: DIE-10
文件頁數(shù): 7/10頁
文件大小: 409K
代理商: XB1004
16.0-30.0 GHz GaAs MMIC
Buffer Amplifier
Page 7 of 10
Mechanical Drawing
Bias Arrangement
Bypass Capacitors
- See App Note [2]
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice.
2005 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
(Note: Engineering designator is 22LN3UA0279)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All Bond Pads are 0.100 x 0.100 (0.004 x 0.004).
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 2.165 mg.
Bond Pad #1 (RF In)
Bond Pad #2 (Vd1)
Bond Pad #3 (Vd2)
Bond Pad #4 (RF Out)
Bond Pad #5 (Vg2c)
Bond Pad #6 (Vg2b)
Bond Pad #7 (Vg2a)
Bond Pad #8 (Vg1c)
Bond Pad #9 (Vg1b)
Bond Pad #10 (Vg1a)
B1004
RF In
Vd1,2
RF Out
Vg1c, Vg2c
April 2005 - Rev 01-Apr-05
1.760
(0.069)
0.798
(0.031)
2
1
3
4
5
6
7
8
9
10
1.500
(0.059)
0.0
0.0
1.359
(0.054)
1.958
(0.077)
1.560
(0.061)
1.158
(0.046)
0.958
(0.038)
2.330
(0.092)
0.798
(0.031)
1.290
(0.051)
1.892
(0.074)
2
1
3
4
5
6
7
8
9
10
Vd1,2
RF In
RF Out
Vg1,2
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XB1004-BD 制造商:MIMIX 制造商全稱:MIMIX 功能描述:16.0-30.0 GHz GaAs MMIC Buffer Amplifier
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XB1004-BD-000W 制造商:MIMIX 制造商全稱:MIMIX 功能描述:16.0-30.0 GHz GaAs MMIC Buffer Amplifier
XB1004-BD-EV1 制造商:MIMIX 制造商全稱:MIMIX 功能描述:16.0-30.0 GHz GaAs MMIC Buffer Amplifier
XB1004-V 制造商:M/A-COM Technology Solutions 功能描述:MMW BUFFER AMPLIFIER