參數(shù)資料
型號: XB1005-BD-000V
廠商: MIMIX BROADBAND INC
元件分類: 衰減器
英文描述: 35.0-45.0 GHz GaAs MMIC Buffer Amplifier
中文描述: 35000 MHz - 45000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
封裝: ROHS COMPLIANT, DIE-8
文件頁數(shù): 9/12頁
文件大?。?/td> 748K
代理商: XB1005-BD-000V
35.0-45.0 GHz GaAs MMIC
Buffer Amplifier
Page 9 of 12
Mechanical Drawing
(Note: Engineering designator is 40LN3UA0063)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All DC Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF Bond Pads are 0.100 x 0.200 (0.004 x 0.008)
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 1.931 mg.
Bond Pad #1 (RF In)
Bond Pad #2 (Vd1)
Bond Pad #4 (Vd3)
Bias Arrangement
Bond Pad #3 (Vd2)
Bond Pad #5 (RF Out)
Bond Pad #6 (Vg3)
Bond Pad #7 (Vg2)
Bond Pad #8 (Vg1)
Bypass Capacitors
- See App Note [2]
Vd1,2,3
RF Out
Vg1,2,3
RF In
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice.
2007 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
March 2007 - Rev 06-Mar-07
B1005-BD
0.577
(0.023)
0.699
(0.028)
1.255
(0.049)
1.054
(0.042)
0.655
(0.026)
1.300
(0.051)
1.715
(0.067)
0.0
0.0
2.400
(0.095)
1
2
3
4
5
6
7
8
1.514
(0.060)
1.113
(0.044)
1
2
3
4
5
6
7
8
Vd1,2,3
RF Out
RF In
Vg1,2,3
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