參數(shù)資料
型號(hào): XC17512LPC20C
廠商: Xilinx Inc
文件頁(yè)數(shù): 5/13頁(yè)
文件大?。?/td> 0K
描述: IC PROM SER C-TEMP 512K 20-PLCC
產(chǎn)品變化通告: Product Discontinuation 28/Jul/2010
標(biāo)準(zhǔn)包裝: 46
可編程類型: OTP
存儲(chǔ)容量: 512kb
電源電壓: 3 V ~ 3.6 V
工作溫度: 0°C ~ 70°C
封裝/外殼: 20-LCC(J 形引線)
供應(yīng)商設(shè)備封裝: 20-PLCC
包裝: 管件
XC1700E, XC1700EL, and XC1700L Series Configuration PROMs
DS027 (v3.5) June 25, 2008
Product Specification
13
R
Notice of Disclaimer
THE XILINX HARDWARE FPGA AND CPLD DEVICES REFERRED TO HEREIN (“PRODUCTS”) ARE SUBJECT TO THE TERMS AND
CONDITIONS OF THE XILINX LIMITED WARRANTY WHICH CAN BE VIEWED AT http://www.xilinx.com/warranty.htm. THIS LIMITED
WARRANTY DOES NOT EXTEND TO ANY USE OF PRODUCTS IN AN APPLICATION OR ENVIRONMENT THAT IS NOT WITHIN THE
SPECIFICATIONS STATED IN THE XILINX DATA SHEET. ALL SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE.
PRODUCTS ARE NOT DESIGNED OR INTENDED TO BE FAIL-SAFE OR FOR USE IN ANY APPLICATION REQUIRING FAIL-SAFE
PERFORMANCE, SUCH AS LIFE-SUPPORT OR SAFETY DEVICES OR SYSTEMS, OR ANY OTHER APPLICATION THAT INVOKES
THE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR PROPERTY OR ENVIRONMENTAL DAMAGE
(“CRITICAL
APPLICATIONS”). USE OF PRODUCTS IN CRITICAL APPLICATIONS IS AT THE SOLE RISK OF CUSTOMER, SUBJECT TO
APPLICABLE LAWS AND REGULATIONS.
06/13/05
3.3
Changed pinout diagrams to include Pb-free packages on "Pinout Diagrams," page 3.
Deleted T
Added VOG8 and PCG20 to "Ordering Information," page 11. Added XC1765ELVOG8C and
XC17256EPCG20 to "Valid Ordering Combinations," page 11. Added new packages types under
07/09/07
3.4
Added Pb-free packages to "PROM Pinouts," page 2.
Note added to Table 1, page 5.
Added SOG package to "Ordering Information," page 11.
Added Pb-free order codes to "Valid Ordering Combinations," page 11.
Added package type E to "Marking Information," page 12.
06/25/08
3.5
Updated "Absolute Maximum Ratings," page 7, added junction temperature rating.
Updated document template.
Updated copyright statement.
Product Obsolete or Under Obsolescence
相關(guān)PDF資料
PDF描述
RGZ-2424D/HP CONV DC/DC 2W 24VIN +/-24VOUT
LT4250LIN8#PBF IC CONTRLR HOT SWAP NEG 48V 8DIP
XC1736EVO8I IC SER CFG PROM 36K 8-SOIC
T97F226K063EAA CAP TANT 22UF 63V 10% 3024
XC1736ESO8I IC PROM SER I-TEMP 36K 8-SOIC
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
XC17512LPC20I 功能描述:IC PROM SER I-TEMP 512K 20-PLCC RoHS:否 類別:集成電路 (IC) >> 存儲(chǔ)器 - 用于 FPGA 的配置 Proms 系列:- 產(chǎn)品變化通告:Product Discontinuation 28/Jul/2010 標(biāo)準(zhǔn)包裝:98 系列:- 可編程類型:OTP 存儲(chǔ)容量:300kb 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC(0.154",3.90mm 寬) 供應(yīng)商設(shè)備封裝:8-TSOP 包裝:管件
XC17512LPD8C 功能描述:IC PROM SER C-TEMP 512K 8-DIP RoHS:否 類別:集成電路 (IC) >> 存儲(chǔ)器 - 用于 FPGA 的配置 Proms 系列:- 產(chǎn)品變化通告:Product Discontinuation 28/Jul/2010 標(biāo)準(zhǔn)包裝:98 系列:- 可編程類型:OTP 存儲(chǔ)容量:300kb 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC(0.154",3.90mm 寬) 供應(yīng)商設(shè)備封裝:8-TSOP 包裝:管件
XC17512LPD8I 功能描述:IC PROM SER I-TEMP 512K 8-DIP RoHS:否 類別:集成電路 (IC) >> 存儲(chǔ)器 - 用于 FPGA 的配置 Proms 系列:- 產(chǎn)品變化通告:Product Discontinuation 28/Jul/2010 標(biāo)準(zhǔn)包裝:98 系列:- 可編程類型:OTP 存儲(chǔ)容量:300kb 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC(0.154",3.90mm 寬) 供應(yīng)商設(shè)備封裝:8-TSOP 包裝:管件
XC17512LSO20C 功能描述:IC PROM SER C-TEMP 512K 20-SOIC RoHS:否 類別:集成電路 (IC) >> 存儲(chǔ)器 - 用于 FPGA 的配置 Proms 系列:- 產(chǎn)品變化通告:Product Discontinuation 28/Jul/2010 標(biāo)準(zhǔn)包裝:98 系列:- 可編程類型:OTP 存儲(chǔ)容量:300kb 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC(0.154",3.90mm 寬) 供應(yīng)商設(shè)備封裝:8-TSOP 包裝:管件
XC17512LSO20I 功能描述:IC PROM SER I-TEMP 512K 20-SOIC RoHS:否 類別:集成電路 (IC) >> 存儲(chǔ)器 - 用于 FPGA 的配置 Proms 系列:- 產(chǎn)品變化通告:Product Discontinuation 28/Jul/2010 標(biāo)準(zhǔn)包裝:98 系列:- 可編程類型:OTP 存儲(chǔ)容量:300kb 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC(0.154",3.90mm 寬) 供應(yīng)商設(shè)備封裝:8-TSOP 包裝:管件