參數(shù)資料
型號(hào)： XC1765EPD8C
廠商： Xilinx Inc
文件頁(yè)數(shù)： 4/13頁(yè)
文件大?。?/td> 0K
描述： IC PROM SERIAL CONFIG 65K 8-DIP
產(chǎn)品變化通告： XC1700 PROMs,XC5200,HQ,SCD Parts Discontinuation 19/Jul/2010
Product Discontinuation 28/Jul/2010
標(biāo)準(zhǔn)包裝： 50
可編程類型： OTP
存儲(chǔ)容量： 65kb
電源電壓： 4.75 V ~ 5.25 V
工作溫度： 0°C ~ 70°C
封裝/外殼： 8-DIP（0.300"，7.62mm）
供應(yīng)商設(shè)備封裝： 8-PDIP
包裝： 管件
其它名稱： 122-1188
XC1700E, XC1700EL, and XC1700L Series Configuration PROMs
DS027 (v3.5) June 25, 2008
Product Specification
12
R
Marking Information
Due to the small size of the commercial serial PROM packages, the complete ordering part number cannot be marked on
the package. The XC prefix is deleted and the package code is simplified. Device marking is as follows:
Revision History
The following table shows the revision history for this document.
.
Date
Version
Revision
7/14/98
1.1
Major revisions to include the XC1704L, XC1702L, and the XQ1701L devices, packages and operating
conditions. Also revised the timing specifications under "AC Characteristics Over Operating Condition,"
9/8/98
2.0
Revised the marking information for the VQ44. Updated "DC Characteristics Over Operating Condition,"
page 7. Added references to the XC4000XLA and XC4000XV families in "Xilinx FPGAs and Compatible
12/18/98
2.1
Added Virtex FPGAs to "Xilinx FPGAs and Compatible PROMs," page 4. Added the PC44 package for
the XC1702L and XC1704L products.
1/27/99
2.2
Changed Military ICCS.
7/8/99
2.3
Changed ICCS standby on XC1702/XC1704 from 50 μA to 300 μA.
3/30/00
3.0
Combined data sheets XC1700E and XC1700L. Added DS027, removed Military Specs. Added Virtex-
E and EM references.
07/05/00
3.1
Added 4.7K resistor to Figure 2, updated format.
09/07/04
3.2
defining TCCE when cascading, and redrew associated timing diagram.
Notes:
1.
When marking the device number on the EL parts, an X is used in place of an EL.
2.
For XC1700E/EL only.
3.
For XC1700L only.
1701L J C
Operating Range/Processing
C= Commercial (TA = 0° to +70°C)
I = Industrial (TA = –40° to +85°C)
Package Type
P = 8-pin Plastic DIP
H = 8-pin Plastic DIP, Pb-Free
S(2) = 8-pin Plastic Small-Outline Package
O = 8-pin Plastic Small-Outline Package, Pb-Free
V = 8-pin Plastic Small-Outline Thin Package
G = 8-pin Plastic Small-Outline Thin Package, Pb-Free
S(3) = 20-pin Plastic Small-Outline Package
J = 20-pin Plastic Leaded Chip Carrier
E = 20-pin Plastic Leaded Chip Carrier, Pb-Free
VQ44 = 44-pin Plastic Quad Flat Package
PC44 = 44-pin Plastic Chip Carrier
Device Number
1736E
1765E
1765X(1)
17128E
17128X(1)
17256E
17256X(1)
1704L
1702L
1701
1701L
17512L
Product Obsolete or Under Obsolescence
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XC1765EPD8I 功能描述:IC PROM SER I-TEMP 3.3V 8-DIP RoHS:否 類別:集成電路 (IC) >> 存儲(chǔ)器 - 用于 FPGA 的配置 Proms 系列:- 產(chǎn)品變化通告:Product Discontinuation 28/Jul/2010 標(biāo)準(zhǔn)包裝:98 系列:- 可編程類型:OTP 存儲(chǔ)容量:300kb 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:8-TSOP 包裝:管件
XC1765EPDG8C 功能描述:IC PROM SERIAL CONFIG 65K 8-DIP RoHS:是 類別:集成電路 (IC) >> 存儲(chǔ)器 - 用于 FPGA 的配置 Proms 系列:- 產(chǎn)品變化通告:Product Discontinuation 28/Jul/2010 標(biāo)準(zhǔn)包裝:98 系列:- 可編程類型:OTP 存儲(chǔ)容量:300kb 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:8-TSOP 包裝:管件
XC1765EPDG8I 制造商:Xilinx 功能描述:
XC1765ESO8C 功能描述:IC PROM SERIAL CONFIG 65K 8-SOIC RoHS:否 類別:集成電路 (IC) >> 存儲(chǔ)器 - 用于 FPGA 的配置 Proms 系列:- 產(chǎn)品變化通告:Product Discontinuation 28/Jul/2010 標(biāo)準(zhǔn)包裝:98 系列:- 可編程類型:OTP 存儲(chǔ)容量:300kb 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:8-TSOP 包裝:管件
XC1765ESO8I 功能描述:IC SER CFG PROM 65K 8-SOIC RoHS:否 類別:集成電路 (IC) >> 存儲(chǔ)器 - 用于 FPGA 的配置 Proms 系列:- 產(chǎn)品變化通告:Product Discontinuation 28/Jul/2010 標(biāo)準(zhǔn)包裝:98 系列:- 可編程類型:OTP 存儲(chǔ)容量:300kb 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:8-TSOP 包裝:管件
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