- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄371341 > XC5210-5PG223I Field Programmable Gate Array (FPGA) PDF資料下載
參數(shù)資料
| 型號(hào)： | XC5210-5PG223I |
| 英文描述： | Field Programmable Gate Array (FPGA) |
| 中文描述： | 現(xiàn)場(chǎng)可編程門陣列（FPGA） |
| 文件頁數(shù)： | 10/73頁 |
| 文件大?。?/td> | 598K |
| 代理商： | XC5210-5PG223I |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁當(dāng)前第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁第68頁第69頁第70頁第71頁第72頁第73頁
R
XC5200 Series Field Programmable Gate Arrays
7-92
November 5, 1998 (Version 5.2)
non-zero hold, attach a NODELAY attribute or property to
the flip-flop or input buffer.
IOB Output Signals
Output signals can be optionally inverted within the IOB,
and pass directly to the pad. As with the inputs, a CLB
flip-flop or latch can be used to store the output signal.
An active-High 3-state signal can be used to place the out-
put buffer in a high-impedance state, implementing 3-state
outputs or bidirectional I/O. Under configuration control,
the output (OUT) and output 3-state (T) signals can be
inverted. The polarity of these signals is independently
configured for each IOB.
The XC5200 devices provide a guaranteed output sink cur-
rent of 8 mA.
Supported destinations for XC5200-Series device outputs
are shown in
Table 6
.(For a detailed discussion of how to
interface between 5 V and 3.3 V devices, see the 3V Prod-
ucts section of The Programmable Logic Data Book)
An output can be configured as open-drain (open-collector)
by placing an OBUFT symbol in a schematic or HDL code,
then tying the 3-state pin (T) to the output signal, and the
input pin (I) to Ground. (See
Figure 12
.)
Table 6: Supported Destinations for XC5200-Series
Outputs
Output Slew Rate
The slew rate of each output buffer is, by default, reduced,
to minimize power bus transients when switching non-criti-
cal signals. For critical signals, attach a FAST attribute or
property to the output buffer or flip-flop.
For XC5200 devices, maximum total capacitive load for
simultaneous fast mode switching in the same direction is
200 pF for all package pins between each Power/Ground
pin pair. For some XC5200 devices, additional internal
Power/Ground pin pairs are connected to special Power
and Ground planes within the packages, to reduce ground
bounce.
For slew-rate limited outputs this total is two times larger for
each device type: 400 pF for XC5200 devices. This maxi-
mum capacitive load should not be exceeded, as it can
result in ground bounce of greater than 1.5 V amplitude and
more than 5 ns duration. This level of ground bounce may
cause undesired transient behavior on an output, or in the
internal logic. This restriction is common to all high-speed
digital ICs, and is not particular to Xilinx or the XC5200
Series.
XC5200-Series devices have a feature called “Soft
Start-up,” designed to reduce ground bounce when all out-
puts are turned on simultaneously at the end of configura-
tion. When the configuration process is finished and the
device starts up, the first activation of the outputs is auto-
matically slew-rate limited. Immediately following the initial
activation of the I/O, the slew rate of the individual outputs
is determined by the individual configuration option for
each IOB.
Global Three-State
A separate Global 3-State line (not shown in
Figure 11
)
forces all FPGA outputs to the high-impedance state,
unless boundary scan is enabled and is executing an
EXTEST instruction. This global net (GTS) does not com-
pete with other routing resources; it uses a dedicated distri-
bution network.
GTS can be driven from any user-programmable pin as a
global 3-state input. To use this global net, place an input
pad and input buffer in the schematic or HDL code, driving
the GTS pin of the STARTUP symbol. A specific pin loca-
tion can be assigned to this input using a LOC attribute or
property, just as with any other user-programmable pad. An
inverter can optionally be inserted after the input buffer to
invert the sense of the Global 3-State signal. Using GTS is
similar to Global Reset. See
Figure 8 on page 90
for
details. Alternatively, GTS can be driven from any internal
node.
Other IOB Options
There are a number of other programmable options in the
XC5200-Series IOB.
Pull-up and Pull-down Resistors
Programmable IOB pull-up and pull-down resistors are
useful for tying unused pins to Vcc or Ground to minimize
power consumption and reduce noise sensitivity. The con-
figurable pull-up resistor is a p-channel transistor that pulls
Destination
XC5200 Output Mode
5 V,
CMOS
XC5200 device, V
CC
=3.3 V,
CMOS-threshold inputs
Any typical device, V
CC
= 3.3 V,
CMOS-threshold inputs
Any device, V
CC
= 5 V,
TTL-threshold inputs
Any device, V
CC
= 5 V,
CMOS-threshold inputs
√
some
1
1. Only if destination device has 5-V tolerant inputs
√
√
X6702
OPAD
OBUFT
Figure 12: Open-Drain Output
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| XC5210-5PQ160I | Field Programmable Gate Array (FPGA) |
| XC5210-5PQ208I | Field Programmable Gate Array (FPGA) |
| XC5210-5PQ240I | Field Programmable Gate Array (FPGA) |
| XC5210-6PQ160I | Field Programmable Gate Array (FPGA) |
| XC5210-6PQ208I | Field Programmable Gate Array (FPGA) |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| XC5210-5PG299C | 制造商:XILINX 制造商全稱:XILINX 功能描述:Field Programmable Gate Arrays |
| XC5210-5PQ100C | 制造商:XILINX 制造商全稱:XILINX 功能描述:Field Programmable Gate Arrays |
| XC5210-5PQ160C | 功能描述:IC FPGA 324 CLB'S 160-PQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:XC5200 產(chǎn)品變化通告:XC4000(E,L) Discontinuation 01/April/2002 標(biāo)準(zhǔn)包裝:24 系列:XC4000E/X LAB/CLB數(shù):100 邏輯元件/單元數(shù):238 RAM 位總計(jì):3200 輸入/輸出數(shù):80 門數(shù):3000 電源電壓:4.5 V ~ 5.5 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:120-BCBGA 供應(yīng)商設(shè)備封裝:120-CPGA（34.55x34.55） |
| XC5210-5PQ160I | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Field Programmable Gate Array (FPGA) |
| XC5210-5PQ208C | 功能描述:IC FPGA 324 CLB'S 208-PQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:XC5200 產(chǎn)品變化通告:XC4000(E,L) Discontinuation 01/April/2002 標(biāo)準(zhǔn)包裝:24 系列:XC4000E/X LAB/CLB數(shù):100 邏輯元件/單元數(shù):238 RAM 位總計(jì):3200 輸入/輸出數(shù):80 門數(shù):3000 電源電壓:4.5 V ~ 5.5 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:120-BCBGA 供應(yīng)商設(shè)備封裝:120-CPGA（34.55x34.55） |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。