參數(shù)資料
型號(hào): XCF32PFS48C
廠商: Xilinx Inc
文件頁(yè)數(shù): 25/35頁(yè)
文件大?。?/td> 0K
描述: IC PROM SRL 1.8V 32M 48CSBGA
標(biāo)準(zhǔn)包裝: 108
可編程類型: 系統(tǒng)內(nèi)可編程
存儲(chǔ)容量: 32Mb
電源電壓: 1.65 V ~ 2 V
工作溫度: -40°C ~ 85°C
封裝/外殼: 48-BFBGA,CSPBGA
供應(yīng)商設(shè)備封裝: 48-CSP(8x9)
包裝: 托盤
Platform Flash In-System Programmable Configuration PROMs
DS123 (v2.18) May 19, 2010
Product Specification
31
R
Figure 14 through Figure 16 illustrate the part markings for each available package.
Note: Package types can differ from the samples shown.
Note: In Figure 15 and Figure 16, the two-digit traceability code on the bottom line between the country of origin and date code is not
present on all devices.
X-Ref Target - Figure 14
Figure 14: 20-Pin TSSOP Marking
X-Ref Target - Figure 15
Figure 15: 48-Pin TSOP Marking
X-Ref Target - Figure 16
Figure 16: 48-Pin TFBGA Marking
XCF04S
XX YWW
Device Number
Xilinx Logo
Traceability Code
Date Code
(YWW = 200Y
workweek #WW)
TSSOP Pin 1
XXX
DS123_30_030908
VG
Package Type
XCF32P
XXX
XXXXX XX
Device Number
Xilinx Logo
Country of Origin
Traceability Code
Date Code
(YWW= 200Y
workweek #WW)
TSOP Pin 1
XXX
YWW
DS123_31_050610
VOG48
Package Type
XX
Fab Code
XCF32P
XXX
XXXXX XX
Device Number
Xilinx Logo
Country of Origin
Fab Code
Traceability Code
Date Code
(YWW= 200Y
workweek #WW)
TFBGA Ball A1
XXX
YWW
DS123_32_050610
FG48
Package Type
XX
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