參數(shù)資料
型號: XP1005
廠商: Mimix Broadband, Inc.
英文描述: 35.0-43.0 GHz GaAs MMIC Power Amplifier
中文描述: 35.0-43.0 GHz的砷化鎵單片功率放大器
文件頁數(shù): 4/7頁
文件大?。?/td> 397K
代理商: XP1005
35.0-43.0 GHz GaAs MMIC
Power Amplifier
Page 4 of 7
Mechanical Drawing
Bias Arrangement
Vg2,3
Bypass Capacitors
- See App Note [2]
(Note: Engineering designator is 38H4PBA0157)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All DC Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF Bond Pads are 0.100 x 0.200 (0.004 x 0.008)
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 3.987 mg.
Bond Pad #1 (RF In)
Bond Pad #2 (Vg2)
Bond Pad #3 (Vd2)
Bond Pad #4 (Vg3A)
Bond Pad #5 (Vd3A)
Bond Pad #6 (Vg4A)
Bond Pad #7 (Vd4A)
Bond Pad #8 (RF Out)
Bond Pad #9 (Vd4B)
Bond Pad #10 (Vg4B)
Bond Pad #11 Vd3B)
Bond Pad #12 (Vg3B)
Bond Pad #13 (Vd1)
Bond Pad #14 (Vg1)
P1005
Vg2,3 Vd2,3
RF Out
Vd4
Vg4
RF In
Vg1
Vd1
XP1005
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice.
2005 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
May 2005 - Rev 05-May-05
1.825
(0.072)
1
2
3
4
5
6
7
8
9
10
11
12
13
1.163
(0.046)
1.562
(0.062)
1.960
(0.077)
2.362
(0.093)
3.162
(0.125)
2.764
(0.109)
2.362
(0.093)
1.960
(0.077)
1.562
(0.062)
1.163
(0.046)
0.0
0.0
0.831
(0.033)
14
2.764
(0.109)
3.162
(0.125)
0.478
(0.019)
3.526
(0.139)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
Vd2,3
RF In
Vg1
RF Out
Vd1
Vg4
Vd4
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