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參數(shù)資料
| 型號(hào)： | XPC8241TZP166B |
| 廠商： | 飛思卡爾半導(dǎo)體(中國(guó))有限公司 |
| 英文描述： | Intergrated Processor Hardware Specifications |
| 中文描述： | 綜合處理器硬件規(guī)格 |
| 文件頁數(shù)： | 2/4頁 |
| 文件大?。?/td> | 217K |
| 代理商： | XPC8241TZP166B |
2
MPC8241 Part Number Specification for the
XPC8241T
XXnnnx
Series
For More Information On This Product,
Go to: www.freescale.com
MOTOROLA
Ordering Information
1.4.1.2
DC Electrical Characteristics
Table 2 provides the recommended operating conditions for the MPC8241 part numbers described herein.
Refer to the
MPC8241 Integrated Processor Hardware Specifications
for more details concerning the part
number specifications.
1.9
Ordering Information
This section provides the part numbering nomenclature for the MPC8241. Note that the individual part
numbers correspond to a maximum processor core frequency. For available frequencies, contact your local
Motorola sales office.
Figure 33 provides the Motorola part numbering nomenclature for the MPC8241. In addition to the
processor frequency, the part numbering scheme also consists of an application modifier. The application
modifier may specify special application conditions, such as specific temperature or voltage ranges. Each
part number also contains a revision code. This refers to the die mask revision number and is specified in
the part numbering scheme for identification purposes only.
.
Figure 33. Motorola Part Number Key
Table 2. Recommended Operating Conditions
Characteristic
Symbol
Recommended
Value
Unit
Die-junction temperature
T
J
–40 to 105
°
C
Note:
These are the recommended and tested operating conditions. Proper device operation outside of these
conditions is not guaranteed.
MPC 8241 X XX nnn X
Product Code
Part Identifier
Package
(ZP = PBGA)
Processor Frequency (166, 200, and 266 MHz)
Revision Level (C)
(T = Extended Temperature Specification, –40
°
to 105
°
C T
J
)
Application Modifier
(ZQ = Thick Substrate, Thick Mold PBGA)
F
Freescale Semiconductor, Inc.
n
.
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