參數(shù)資料
型號: XPC850DEVR66BU
廠商: Freescale Semiconductor
文件頁數(shù): 8/72頁
文件大小: 0K
描述: IC MPU POWERQUICC 66MHZ 256-PBGA
標準包裝: 60
系列: MPC8xx
處理器類型: 32-位 MPC8xx PowerQUICC
速度: 66MHz
電壓: 3.3V
安裝類型: 表面貼裝
封裝/外殼: 256-LBGA
供應(yīng)商設(shè)備封裝: 256-PBGA(23x23)
包裝: 托盤
MPC850 PowerQUICC Integrated Communications Processor Hardware Specifications, Rev. 2
16
Freescale Semiconductor
Bus Signal Timing
B31
CLKOUT falling edge to CS
valid - as requested by control
bit CST4 in the corresponding
word in the UPM
1.50
6.00
1.50
6.00
1.50
6.00
50.00
ns
B31a
CLKOUT falling edge to CS
valid - as requested by control
bit CST1 in the corresponding
word in the UPM
5.00
12.00
8.00
14.00
6.00
13.00
0.250
50.00
ns
B31b
CLKOUT rising edge to CS valid
- as requested by control bit
CST2 in the corresponding
word in the UPM
1.50
8.00
1.50
8.00
1.50
8.00
50.00
ns
B31c
CLKOUT rising edge to CS valid
- as requested by control bit
CST3 in the corresponding
word in the UPM
5.00
12.00
8.00
14.00
6.00
13.00
0.250
50.00
ns
B31d
CLKOUT falling edge to CS
valid - as requested by control
bit CST1 in the corresponding
word in the UPM EBDF = 1
9.00
14.00 13.00 18.00
11.00
16.00
0.375
50.00
ns
B32
CLKOUT falling edge to BS
valid - as requested by control
bit BST4 in the corresponding
word in the UPM
1.50
6.00
1.50
6.00
1.50
6.00
50.00
ns
B32a
CLKOUT falling edge to BS
valid - as requested by control
bit BST1 in the corresponding
word in the UPM, EBDF = 0
5.00
12.00
8.00
14.00
6.00
13.00
0.250
50.00
ns
B32b
CLKOUT rising edge to BS valid
- as requested by control bit
BST2 in the corresponding
word in the UPM
1.50
8.00
1.50
8.00
1.50
8.00
50.00
ns
B32c
CLKOUT rising edge to BS valid
- as requested by control bit
BST3 in the corresponding
word in the UPM
5.00
12.00
8.00
14.00
6.00
13.00
0.250
50.00
ns
B32d
CLKOUT falling edge to BS
valid - as requested by control
bit BST1 in the corresponding
word in the UPM, EBDF = 1
9.00
14.00 13.00 18.00
11.00
16.00
0.375
50.00
ns
B33
CLKOUT falling edge to GPL
valid - as requested by control
bit GxT4 in the corresponding
word in the UPM
1.50
6.00
1.50
6.00
1.50
6.00
50.00
ns
Table 6. Bus Operation Timing 1 (continued)
Num
Characteristic
50 MHz
66 MHz
80 MHz
FFACT
Cap Load
(default
50 pF)
Unit
Min
Max
Min
Max
Min
Max
相關(guān)PDF資料
PDF描述
IDT70V9089L9PF IC SRAM 512KBIT 9NS 100TQFP
XPC850DEVR50BUR2 IC MPU POWERQUICC 50MHZ 256-PBGA
IDT70V9089L12PFI IC SRAM 512KBIT 12NS 100TQFP
XPC850DECVR66BU IC MPU POWERQUICC 66MHZ 256-PBGA
IDT709379L9PF IC SRAM 576KBIT 9NS 100TQFP
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
XPC850DEVR66BUR2 功能描述:IC MPU POWERQUICC 66MHZ 256-PBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC8xx 標準包裝:2 系列:MPC8xx 處理器類型:32-位 MPC8xx PowerQUICC 特點:- 速度:133MHz 電壓:3.3V 安裝類型:表面貼裝 封裝/外殼:357-BBGA 供應(yīng)商設(shè)備封裝:357-PBGA(25x25) 包裝:托盤
XPC850DEVR80BU 功能描述:IC MPU POWERQUICC 80MHZ 256-PBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC8xx 標準包裝:2 系列:MPC8xx 處理器類型:32-位 MPC8xx PowerQUICC 特點:- 速度:133MHz 電壓:3.3V 安裝類型:表面貼裝 封裝/外殼:357-BBGA 供應(yīng)商設(shè)備封裝:357-PBGA(25x25) 包裝:托盤
XPC850DEZT50B 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:Communications Controller Hardware Specifications
XPC850DEZT50BT 功能描述:IC POWER PC MPU 80MHZ 256-PBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC8xx 標準包裝:2 系列:MPC8xx 處理器類型:32-位 MPC8xx PowerQUICC 特點:- 速度:133MHz 電壓:3.3V 安裝類型:表面貼裝 封裝/外殼:357-BBGA 供應(yīng)商設(shè)備封裝:357-PBGA(25x25) 包裝:托盤
XPC850DEZT50BU 功能描述:IC MPU POWERQUICC 50MHZ 256-PBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC8xx 標準包裝:1 系列:MPC85xx 處理器類型:32-位 MPC85xx PowerQUICC III 特點:- 速度:1.2GHz 電壓:1.1V 安裝類型:表面貼裝 封裝/外殼:783-BBGA,F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:783-FCPBGA(29x29) 包裝:托盤