參數(shù)資料
型號: XPC850ZT50BU
英文描述: Microprocessor
中文描述: 微處理器
文件頁數(shù): 69/76頁
文件大?。?/td> 825K
代理商: XPC850ZT50BU
MOTOROLA
MPC850 (Rev. A/B/C) Hardware Specifications
69
Pin Assignments and Mechanical Dimensions of the PBGA
Figure 9-63 shows the JEDEC pinout of the PBGA package as viewed from the top surface.
Figure 9-63. Pin Assignments for the PBGA (Top View)—JEDEC Standard
For more information on the printed circuit board layout of the PBGA package, including
thermal via design and suggested pad layout, please refer to AN-1231/D, Plastic Ball Grid
Array Application Note available from your local Motorola sales office.
PC14
PB28
PB27
PC12
TCK
PB24
PB23
PA8
PA7
VDDL
PA5
PC7
PC4
PD14
PD10
PD8
PC15
PA14
PA13
PA12
TMS
PB26
PA15
PB30
PB29
PC13
TRST
N/C
PC10
PA6
PB18
PC5
PD13
PD9
PD4
PD5
A8
A7
PB31
TDO
TDI
PC11
PB22
PC9
PB25
PA9
PC8
A11
A9
A12
PB19
PA4
PB16
PD15
PD12
PD7
PD6
PB17
PC6
PD11
PD3
IRQ7
IRQ1
IRQ0
U
T
R
P
N
A15
A14
A13
A27
A19
A16
VDDL
A20
A21
A29
A23
A25
A28
A30
A22
A31
TSIZ0
A26
WE1
TSIZ1
WE0
WE2
GPLA3
GPLA1 GPLA2
CS6
D8
D0
D4
D1
D9
D11
D2
D3
L
K
J
M
D16
D5
D19
VDDL
D21
D6
D29
D7
D30
CLKOUT
DP3
N/C
GND
H
G
VDDH
F
E
CS4
CS7
CS2
XFC VDDSYN
BI
N/C
CS3
CS1
BDIP
BURST IPB4
ALEB
IRQ4 MODCK2HRESETSRESETPORESET
VSSSYN1VSSSYN
BR
BB
IRQ6
IPB3
IPB0
VDDLEXTCLKEXTAL XTAL KAPWR
D
C
B
TA
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
A6
A10
A17
A24
A18
WE3
GPLA0
CS5
WR
GPLB4
CS0
TS
IRQ2
IPB7
IPB2 MODCK1 TEXP
DP1
DP2
GPLA4
TEA
BG
IPB5
IPB1
IPB6
RSTCONFWAITB DP0
GPLA5
D12
D13
D23
D27
D17
D10
D15
D14
D22
D18
D25
D20
D28
D24
D26
D31
N/C
N/C
N/C
N/C
N/C
N/C
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