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參數(shù)資料
| 型號(hào)： | XPC850ZT50BU |
| 英文描述： | Microprocessor |
| 中文描述： | 微處理器 |
| 文件頁(yè)數(shù)： | 8/76頁(yè) |
| 文件大?。?/td> | 825K |
| 代理商： | XPC850ZT50BU |
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8
MPC850 (Rev. A/B/C) Hardware Specifications
MOTOROLA
This device contains circuitry protecting against damage due to high-static voltage or
electrical fields; however, it is advised that normal precautions be taken to avoid application
of any voltages higher than maximum-rated voltages to this high-impedance circuit.
Reliability of operation is enhanced if unused inputs are tied to an appropriate logic voltage
level (for example, either GND or V
CC
). Table 4-3 provides the package thermal
characteristics for the MPC850.
Table 3-2. Maximum Ratings
(GND = 0V)
Rating
Symbol
Value
Unit
Supply voltage
VDDH
-0.3 to 4.0
V
VDDL
-0.3 to 4.0
V
KAPWR
-0.3 to 4.0
V
VDDSYN
-0.3 to 4.0
V
Input voltage
1
1
Functional operating conditions are provided with the DC electrical specifications in Table 4-5. Absolute maximum
ratings are stress ratings only; functional operation at the maxima is not guaranteed. Stress beyond those listed may
affect device reliability or cause permanent damage to the device.
CAUTION: All inputs that tolerate 5 V cannot be more than 2.5 V greater than the supply voltage. This restriction
applies to power-up and normal operation (that is, if the MPC850 is unpowered, voltage greater than 2.5 V must not
be applied to its inputs).
The MPC850, a high-frequency device in a BGA package, does not provide a guaranteed maximum ambient
temperature. Only maximum junction temperature is guaranteed. It is the responsibility of the user to consider power
dissipation and thermal management. Junction temperature ratings are the same regardless of frequency rating of
the device.
V
in
GND-0.3 to VDDH + 2.5 V
V
Junction temperature
2
2
T
j
0 to 95 (standard)
-40 to 95 (extended)
C
Storage temperature range
T
stg
-55 to +150
C
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