參數(shù)資料
型號: XPC855TZP80
英文描述: Controller Miscellaneous - Datasheet Reference
中文描述: 控制器雜項(xiàng)-數(shù)據(jù)表參考
文件頁數(shù): 67/76頁
文件大小: 825K
代理商: XPC855TZP80
67
MPC850 (Rev. A/B/C) Hardware Specifications
MOTOROLA
Pin Assignments and Mechanical Dimensions of the PBGA
Table 9-27 identifies the packages and operating frequencies available for the MPC850.
9.1
Pin Assignments and Mechanical Dimensions of
the PBGA
The original pin numbering of the MPC850 conformed to a Motorola proprietary pin
numbering scheme that has since been replaced by the JEDEC pin numbering standard for
this package type. To support customers that are currently using the non-JEDEC pin
numbering scheme, two sets of pinouts, JEDEC and non-JEDEC, are presented in this
document.
Table 9-27. MPC850 Package/Frequency/Availability
Package Type
Frequency (MHz)
Temperature (Tj)
Order Number
256-Lead Plastic Ball Grid Array
(ZT suffix)
50
0°C to 95°C
XPC850ZT50BU
XPC850DEZT50BU
XPC850SRZT50BU
XPC850DSLZT50BU
66
0°C to 95°C
XPC850ZT66BU
XPC850DEZT66BU
XPC850SRZT66BU
80
0°C to 95°C
XPC850ZT80BU
XPC850DEZT80BU
XPC850SRZT80BU
256-Lead Plastic Ball Grid Array
(CZT suffix)
50
-40°C to 95°C
XPC850CZT50BU
XPC850DECZT50BU
XPC850SRCZT50BU
XPC850DSLCZT50BU
66
XPC850CZT66BU
XPC850DECZT66BU
XPC850SRCZT66BU
80
XPC850CZT80B
XPC850DECZT80B
XPC850SRCZT80B
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