- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄385956 > XR1007-BD-000X (MIMIX BROADBAND INC) 11.0-17.0 GHz GaAs MMIC Receiver PDF資料下載
參數(shù)資料
| 型號： | XR1007-BD-000X |
| 廠商： | MIMIX BROADBAND INC |
| 元件分類： | 通信及網(wǎng)絡(luò) |
| 英文描述： | 11.0-17.0 GHz GaAs MMIC Receiver |
| 中文描述： | SPECIALTY TELECOM CIRCUIT, UUC10 |
| 封裝： | ROHS COMPLIANT, DIE-10 |
| 文件頁數(shù)： | 8/8頁 |
| 文件大?。?/td> | 453K |
| 代理商： | XR1007-BD-000X |
11.0-17.0 GHz GaAs MMIC
Receiver
Page 8 of 8
Handling and Assembly Information
CAUTION!
- Mimix Broadband MMIC Products contain gallium arsenide (GaAs) which can be hazardous to the
human body and the environment. For safety, observe the following procedures:
Do not ingest.
Do not alter the form of this product into a gas, powder, or liquid through burning, crushing, or chemical
processing as these by-products are dangerous to the human body if inhaled, ingested, or swallowed.
Observe government laws and company regulations when discarding this product. This product must be
discarded in accordance with methods specified by applicable hazardous waste procedures.
Life Support Policy
- Mimix Broadband's products are not authorized for use as critical components in life support
devices or systems without the express written approval of the President and General Counsel of Mimix Broadband. As
used herein: (1) Life support devices or systems are devices or systems which, (a) are intended for surgical implant into
the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions
for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. (2) A critical
component is any component of a life support device or system whose failure to perform can be reasonably expected
to cause the failure of the life support device or system, or to affect its safety or effectiveness.
ESD
- Gallium Arsenide (GaAs) devices are susceptible to electrostatic and mechanical damage. Die are supplied in anti-
static containers, which should be opened in cleanroom conditions at an appropriately grounded antistatic workstation.
Devices need careful handling using correctly designed collets, vacuum pickups or, with care, sharp tweezers.
Die Attachment
- GaAs Products from Mimix Broadband are 0.100 mm (0.004") thick and have vias through to the back-
side to enable grounding to the circuit. Microstrip substrates should be brought as close to the die as possible. The
mounting surface should be clean and flat. If using conductive epoxy, recommended epoxies are Tanaka TS3332LD, Die
Mat DM6030HK or DM6030HK-Pt cured in a nitrogen atmosphere per manufacturer's cure schedule. Apply epoxy
sparingly to avoid getting any on to the top surface of the die. An epoxy fillet should be visible around the total die
periphery. For additional information please see the Mimix "Epoxy Specifications for Bare Die" application note. If
eutectic mounting is preferred, then a fluxless gold-tin (AuSn) preform, approximately 0.001
2
thick, placed between the
die and the attachment surface should be used. A die bonder that utilizes a heated collet and provides scrubbing action
to ensure total wetting to prevent void formation in a nitrogen atmosphere is recommended. The gold-tin eutectic
(80% Au 20% Sn) has a melting point of approximately 280o C (Note: Gold Germanium should be avoided). The work
station temperature should be 310oC +/- 10o C. Exposure to these extreme temperatures should be kept to minimum.
The collet should be heated, and the die pre-heated to avoid excessive thermal shock. Avoidance of air bridges and force
impact are critical during placement.
Wire Bonding
- Windows in the surface passivation above the bond pads are provided to allow wire bonding to the
die's gold bond pads. The recommended wire bonding procedure uses 0.076 mm x 0.013 mm (0.003" x 0.0005") 99.99%
pure gold ribbon with 0.5-2% elongation to minimize RF port bond inductance. Gold 0.025 mm (0.001") diameter wedge
or ball bonds are acceptable for DC Bias connections. Aluminum wire should be avoided. Thermo-compression bonding
is recommended though thermosonic bonding may be used providing the ultrasonic content of the bond is minimized.
Bond force, time and ultrasonics are all critical parameters. Bonds should be made from the bond pads on the die to the
package or substrate. All bonds should be as short as possible.
Ordering Information
XR1007-BD-000X
XR1007-BD-EV1
Where “X” is RoHS compliant die packed in “V” – vacuum released gel paks or “W” – waffle trays
XR1007-BD evaluation module
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice.
2006 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
R1007
October 2006 - Rev 13-Oct-06
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| XR1007-BD-EV1 | 11.0-17.0 GHz GaAs MMIC Receiver |
| XR1007-QD | 10.0-18.0 GHz GaAs Receiver QFN, 7x7 mm |
| XR1007-QD-0N00 | 10.0-18.0 GHz GaAs Receiver QFN, 7x7 mm |
| XR1007-QD-0N0T | 10.0-18.0 GHz GaAs Receiver QFN, 7x7 mm |
| XR1007-QD-EV1 | 10.0-18.0 GHz GaAs Receiver QFN, 7x7 mm |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| XR1007-BD-EV1 | 制造商:MIMIX 制造商全稱:MIMIX 功能描述:11.0-17.0 GHz GaAs MMIC Receiver |
| XR-1007CN | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Analog Filter |
| XR-1007CP | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Analog Filter |
| XR1007D | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Analog Filter |
| XR1007-QD | 制造商:MIMIX 制造商全稱:MIMIX 功能描述:10.0-18.0 GHz GaAs Receiver |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。