參數(shù)資料
型號(hào): YNV12T05
廠商: POWER-ONE INC
元件分類(lèi): 電源模塊
英文描述: DC-DC REG PWR SUPPLY MODULE
封裝: ROHS COMPLIANT, SIP-5
文件頁(yè)數(shù): 1/26頁(yè)
文件大小: 429K
代理商: YNV12T05
Mar 25, 2005 revised to JUL 28, 2006
Page 1 of 26
www.power-one.com
YNV12T05 DC-DC Converter Data Sheet
9.6-14 VDC Input; 0.7525-5.5 VDC Programmable @ 5 A
Applications
Intermediate Bus Architectures
Telecommunications
Data communications
Distributed Power Architectures
Servers, workstations
Benefits
High efficiency – no heat sink required
Reduces Total Solution Board Area
Minimizes part numbers in Inventory
The
Products: Y-Series
Features
RoHS lead-free solder and lead-solder-exempted
products are available
Delivers up to 5 A (27.5 W)
Industry-standard footprint and pinout
Single-in-Line (SIP) Package:
o
0.90” x 0.40” x 0.213”
o
22.86 mm x 10.16 mm x 5.41 mm
Weight: 0.07 oz [2.00 g]
Synchronous Buck Converter Topology
Start-up into pre-biased output
No minimum load required
Operating ambient temperature: -40 °C to 85 °C
Remote ON/OFF
Fixed-frequency operation
Auto-reset output overcurrent protection
Auto-reset overtemperature protection
High reliability, MTBF approx. 71.8 million hours
All materials meet UL94, V-0 flammability rating
UL60950 recognition in U.S. & Canada, and
DEMKO certification per IEC/EN60950
Description
The YNV12T05 non-isolated DC-DC converters deliver up to 5 A of output current in an industry-standard
through-hole (SIP) package. The YNV12T05 converters operate from a 9.6 VDC–14 VDC input. These converters
are ideal choices for Intermediate Bus Architectures where Point-of-Load power delivery is generally a
requirement. They provide a resistor-programmable regulated output voltage of 0.7525 to 5.5 VDC.
The YNV12T05 converters provide exceptional thermal performance, even in high temperature environments with
minimal airflow. This is accomplished through the use of circuit, packaging and processing techniques to achieve
ultra-high efficiency, excellent thermal management, and a very sleek body profile.
The sleek body profile and the preclusion of heat sinks minimize impedance to system airflow, thus enhancing
cooling for both upstream and downstream devices. The use of 100% automation for assembly, coupled with
advanced power electronics and thermal design, results in a product with extremely high reliability.
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