參數(shù)資料
型號(hào): μPD70P3002
廠商: NEC Corp.
英文描述: 16/32 Single -Chip Microcontroller(16/32 位單片微控制器)
中文描述: 16/32單片機(jī)(16/32位單片微控制器)
文件頁數(shù): 7/56頁
文件大?。?/td> 367K
代理商: ΜPD70P3002
μ
PD70P3002
7
1. DIFFERENCES BETWEEN
μ
PD70P3002 AND
μ
PD703002
The
μ
PD70P3002 is a PROM version of the
μ
PD703002. Therefore, these two versions are identical except
for differences because of the ROM specifications (for example, specifications concerning writing and verifying).
Table 1-1 and 1-2 show the differences between the two.
Note that this document mainly describes the PROM specifications of the
μ
PD70P3002. For the other
functions, refer to the documents on the
μ
PD703002.
Table 1-1. Differences between
μ
PD70P3002 and
μ
PD703002
Item
Internal program memory
(electrical writing)
Part Number
μ
PD70P3002
μ
PD703002
One-time PROM
(can be written only once)
Mask ROM
PROM programming pin
Provided
None
Setting of MODE0 and
MODE1 pins
In normal operation mode
MODE0, 1 = LH
In PROM programming mode
MODE0, 1 = HH
In normal operation mode
MODE0, 1 = LH
In ROM-less mode
MODE0, 1 = LL
Electrical specifications
Refer to
Table 1-2 Electrical Specifications Differences between
μ
PD70P3002 and
μ
PD703002
Others
Noise immunity and noise radiation differ because circuit scale and mask layout differ.
Cautions
1. The PROM and mask ROM versions differ from each other in terms of noise immunity and
noise emission. When replacing the PROM version with the mask ROM version in the course
of switching from experimental production to mass production, perform thorough evalua-
tion with the CS model (not ES model) of the mask ROM version.
2. Directly connect the MODE0 and MODE1 pins to V
DD
or V
SS
.
3. If the PROM version is replaced with the mask ROM version, the same code should be written
in the vacant area of internal ROM.
Remark
L : low level
H : high level
Table 1-2. Electrical Specifications Differences between
μ
PD70P3002 and
μ
PD703002
Item
Symbol
Absolute maximum ratings
Input voltage
V
I2
Operating ambient temperature
T
A
DC characteristics
Supply current
Operating
I
DD1
In HALT mode
I
DD2
In IDLE mode
I
DD3
In STOP mode
I
DD4
Data retention characteristics
Data hold current
I
DDDR
AC characteristics
Clock timing
Freerunning oscillation frequency
φ
P
Recommended oscillation circuit
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