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| 型號： | 0W888-002-XTP |
| 廠商： | ON Semiconductor |
| 文件頁數(shù)： | 2/30頁 |
| 文件大?。?/td> | 0K |
| 描述： | DSP BELASIGNA 250 AUDIO 64LFBGA |
| 標準包裝： | 1,500 |
| 系列： | BelaSigna® 250 |
| 類型： | 音頻處理器 |
| 應(yīng)用： | 便攜式設(shè)備 |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 64-LFBGA |
| 供應(yīng)商設(shè)備封裝： | 64-LFBGA（7x7） |
| 包裝： | 帶卷 (TR) |
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BELASIGNA 250
http://onsemi.com
10
Recommended Design Guidelines
BELASIGNA 250 is designed to allow both digital and
analog processing in a single system. Due to the
mixedsignal nature of this system, the careful design of the
printed circuit board (PCB) layout is critical to maintain the
high audio fidelity of BELASIGNA 250. To avoid coupling
noise into the audio signal path, keep the digital traces away
from the analog traces. To avoid electrical feedback
coupling, isolate the input traces from the output traces.
Recommended Ground Design Strategy
The ground plane should be partitioned into two: the
analog ground plane (AGND) and the digital ground plane
(DGND). These two planes should be connected together at
a single point, known as the star point. The star point should
be located at the ground terminal of a capacitor on the output
of the power regulator as illustrated in Figure 1.
The DGND plane is used as the ground return for digital
circuits and should be placed under digital circuits. The
AGND plane should be kept as noisefree as possible. It is
used as the ground return for analog circuits and it should
surround analog components and pins. It should not be
connected to or placed under any noisy circuits such as RF
chips, switching supplies or digital pads of BELASIGNA
250 itself. Analog ground returns associated with the audio
output stage should connect back to the star point on separate
individual traces.
For more information on the recommended ground design
In some designs, space constraints may make separate
ground planes impractical. In this case a star configuration
strategy should be used. Each analog ground return should
connect to the star point with separate traces.
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