參數(shù)資料
型號： 20-101-1055
廠商： Rabbit Semiconductor
文件頁數(shù)： 145/164頁
文件大?。?/td> 0K
描述： MODULE RABBITCORE RCM3375
標準包裝： 1
系列： RabbitCore®
模塊/板類型： MPU 核心模塊
適用于相關(guān)產(chǎn)品： RCM3375
其它名稱： 316-1112
User’s Manual
75
Table A-4 lists the delays in gross memory access time at 3.3 V.
The measurements are taken at the 50% points under the following conditions.
T = -40°C to 85°C, V = VDD ±10%
Internal clock to nonloaded CLK pin delay
≤ 1 ns @ 85°C/3.0 V
The clock to address output delays are similar, and apply to the following delays.
Tadr, the clock to address delay
TCSx, the clock to memory chip select delay
TIOCSx, the clock to I/O chip select delay
TIORD, the clock to I/O read strobe delay
TIOWR, the clock to I/O write strobe delay
TBUFEN, the clock to I/O buffer enable delay
The data setup time delays are similar for both Tsetup and Thold.
When both the spectrum spreader and the clock doubler are enabled, every other clock
cycle is shortened (sometimes lengthened) by a maximum amount given in the table
above. The shortening takes place by shortening the high part of the clock. If the doubler
is not enabled, then every clock is shortened during the low part of the clock period. The
maximum shortening for a pair of clocks combined is shown in the table.
Technical Note TN227, Interfacing External I/O with Rabbit 2000/3000 Designs, con-
tains suggestions for interfacing I/O devices to the Rabbit 3000 microprocessors.
Table A-4. Data and Clock Delays VIN ±10%, Temp, -40°C–+85°C (maximum)
VIN
Clock to Address Output Delay
(ns)
Data Setup
Time Delay
(ns)
Spectrum Spreader Delay
(ns)
30 pF
60 pF
90 pF
Normal
no dbl/dbl
Strong
no dbl/dbl
3.3 V
6
8
11
1
3/4.5
4.5/9
相關(guān)PDF資料
PDF描述
20-101-0434 MODULE RABBITCORE RCM2100
046232103103800 CONN FFC/FPC 3POS 1MM R/A SMD
355-030-521-204 CARDEDGE 30POS DL .156 LOPRO BLK
355-030-521-202 CARDEDGE 30POS DL .156 LOPRO BLK
355-030-521-201 CARDEDGE 30POS DL .156 LOPRO BLK
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
20-101-1066 功能描述:模塊化系統(tǒng) - SOM RCM3720 PROTO RS232 RoHS:否 制造商:Digi International 外觀尺寸:ConnectCore 9P 處理器類型:ARM926EJ-S 頻率:150 MHz 存儲容量:8 MB, 16 MB 存儲類型:NOR Flash, SDRAM 接口類型:I2C, SPI, UART 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 尺寸:1.97 in x 1.97 in x 6.1 in
20-101-1067 功能描述:模塊化系統(tǒng) - SOM RCM3305 MODULE RoHS:否 制造商:Digi International 外觀尺寸:ConnectCore 9P 處理器類型:ARM926EJ-S 頻率:150 MHz 存儲容量:8 MB, 16 MB 存儲類型:NOR Flash, SDRAM 接口類型:I2C, SPI, UART 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 尺寸:1.97 in x 1.97 in x 6.1 in
20-101-1068 功能描述:模塊化系統(tǒng) - SOM RCM3315 MODULE RoHS:否 制造商:Digi International 外觀尺寸:ConnectCore 9P 處理器類型:ARM926EJ-S 頻率:150 MHz 存儲容量:8 MB, 16 MB 存儲類型:NOR Flash, SDRAM 接口類型:I2C, SPI, UART 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 尺寸:1.97 in x 1.97 in x 6.1 in
20-101-1087 制造商:Digi International 功能描述:RCM3365 RABBITSYS - Bulk 制造商:Digi International Inc 功能描述:BOARD PROTO RCM3365 RS232 制造商:Rabbit Semiconductor 功能描述:RCM3365 Rabbit Sys
20-101-1093 功能描述:模塊化系統(tǒng) - SOM RCM4110 RABBIT CORE MODULE RoHS:否 制造商:Digi International 外觀尺寸:ConnectCore 9P 處理器類型:ARM926EJ-S 頻率:150 MHz 存儲容量:8 MB, 16 MB 存儲類型:NOR Flash, SDRAM 接口類型:I2C, SPI, UART 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 尺寸:1.97 in x 1.97 in x 6.1 in
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。

采購需求

(若只采購一條型號，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

*型號 *數(shù)量 廠商 批號 封裝
添加更多采購

我的聯(lián)系方式

*
*
*