參數(shù)資料
型號: 2486
廠商: Linear Technology Corporation
英文描述: 16-Bit 2-/4-Channel ツヒ ADC with PGA and Easy Drive Input Current Cancellation
中文描述: 16位2-/4-ChannelツヒADC,帶PGA和簡易輸入電流驅(qū)動取消
文件頁數(shù): 35/36頁
文件大?。?/td> 596K
代理商: 2486
LTC2486
35
2486f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PACKAGE DESCRIPTION
DE Package
14-Lead Plastic DFN (4mm
×
3mm)
(Reference LTC DWG # 05-08-1708 Rev A)
3.00
±
0.10
(2 SIDES)
4.00
±
0.10
(2 SIDES)
NOTE:
1. DRAWING PROPOSED TO BE MADE VARIATION OF VERSION (WGED-3) IN JEDEC
PACKAGE OUTLINE MO-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
0.40
±
0.10
BOTTOM VIEW—EXPOSED PAD
1.70
±
0.05
(2 SIDES)
0.75
±
0.05
R = 0.115
TYP
R = 0.05
TYP
3.30
±
0.05
(2 SIDES)
1
7
14
8
PIN 1
TOP MARK
(SEE NOTE 6)
0.200 REF
0.00 – 0.05
(DE14) DFN 0905 REV A
0.25
±
0.05
0.50 BSC
PIN 1 NOTCH
R = 0.20 OR
0.35
×
45
°
CHAMFER
3.30
±
0.05
(2 SIDES)
RECOMMENDED
SOLDER PAD PITCH AND DIMENSIONS
1.70
±
0.05
(2 SIDES)
2.20
±
0.05
0.50
BSC
0.70
±
0.05
3.60
±
0.05
PACKAGE
OUTLINE
0.25
±
0.05
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