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參數(shù)資料
| 型號(hào)： | 24LC256IP |
| 廠商： | Microchip Technology Inc. |
| 英文描述： | 256K I 2 C ⑩ CMOS Serial EEPROM |
| 中文描述： | 256K的I 2 C⑩的CMOS串行EEPROM |
| 文件頁(yè)數(shù)： | 11/12頁(yè) |
| 文件大小： | 181K |
| 代理商： | 24LC256IP |
24AA256/24LC256
DS21203C-page 8
1998 Microchip Technology Inc.
7.0
ACKNOWLEDGE POLLING
Since the device will not acknowledge during a write
cycle, this can be used to determine when the cycle is
complete (This feature can be used to maximize bus
throughput.) Once the stop condition for a write com-
mand has been issued from the master, the device ini-
tiates the internally timed write cycle. ACK polling can
be initiated immediately. This involves the master send-
ing a start condition, followed by the control byte for a
write command (R/W = 0). If the device is still busy with
the write cycle, then no ACK will be returned. If no ACK
is returned, then the start bit and control byte must be
resent. If the cycle is complete, then the device will
return the ACK, and the master can then proceed with
the next read or write command. See Figure 7-1 for
ow diagram.
FIGURE 7-1:
ACKNOWLEDGE POLLING
FLOW
Send
Write Command
Send Stop
Condition to
Initiate Write Cycle
Send Start
Send Control Byte
with R/W = 0
Did Device
Acknowledge
(ACK = 0)?
Next
Operation
NO
YES
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 24LC256ISM | 制造商:Microchip 功能描述:SHIPS IN 24 HOURS GREEN 制造商:Microchip Technology Inc 功能描述: |
| 24LC256SC/S15K | 制造商:Microchip Technology Inc 功能描述:256K I2C SMARTCARD EE DIE IN WAFFLE PK - Gel-pak, waffle pack, wafer, diced wafer on film |
| 24LC256SC/W15K | 制造商:Microchip Technology Inc 功能描述:256K I2C SMARTCARD EE WAFER - Gel-pak, waffle pack, wafer, diced wafer on film |
| 24LC256SC/WF15K | 制造商:Microchip Technology Inc 功能描述:256K I2C SMARTCARD EE WFR ON FR - Gel-pak, waffle pack, wafer, diced wafer on film |
| 24LC256T-E/MF | 功能描述:電可擦除可編程只讀存儲(chǔ)器 256K 32K X 8 2.5V SER EE EXT RoHS:否 制造商:Atmel 存儲(chǔ)容量:2 Kbit 組織:256 B x 8 數(shù)據(jù)保留:100 yr 最大時(shí)鐘頻率:1000 KHz 最大工作電流:6 uA 工作電源電壓:1.7 V to 5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 |
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