參數資料
型號: 25LC010A
廠商: Microchip Technology Inc.
英文描述: 1K SPI Bus Serial EEPROM
中文描述: 每1000 SPI總線串行EEPROM
文件頁數: 17/28頁
文件大?。?/td> 362K
代理商: 25LC010A
2006 Microchip Technology Inc.
Preliminary
DS21832C-page 17
25AA010A/25LC010A
8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC)
Foot Angle
Lead Thickness
φ
c
0
4
8
0
4
8
15
12
0
15
12
0
β
Mold Draft Angle Bottom
*
Controlling Parameter
§
Significant Characteristic
15
12
0
15
12
0
α
Mold Draft Angle Top
0.51
0.42
0.33
.020
.017
.013
B
Lead Width
0.25
0.23
0.20
.010
.009
.008
0.76
0.62
0.48
.030
.025
.019
L
Foot Length
0.51
0.38
0.25
.020
.015
.010
h
Chamfer Distance
5.00
4.90
4.80
.197
.193
.189
D
Overall Length
3.99
3.91
3.71
.157
.154
.146
E1
Molded Package Width
6.20
6.02
5.79
.244
.237
.228
E
Overall Width
0.25
0.18
0.10
.010
.007
.004
A1
Standoff
§
1.55
1.42
1.32
.061
.056
.052
A2
Molded Package Thickness
1.75
1.55
1.35
.069
.061
.053
A
Overall Height
1.27
.050
p
Pitch
8
8
n
Number of Pins
MAX
NOM
MIN
MAX
NOM
MIN
Dimension Limits
MILLIMETERS
INCHES
*
Units
2
1
D
n
B
E
E1
h
L
β
c
45
°
φ
A2
α
A
A1
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
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