參數(shù)資料
型號(hào)： 25LC010A
廠商： Microchip Technology Inc.
英文描述： 1K SPI Bus Serial EEPROM
中文描述： 每1000 SPI總線串行EEPROM
文件頁(yè)數(shù)： 20/28頁(yè)
文件大?。?/td> 362K
代理商： 25LC010A
25AA010A/25LC010A
DS21832C-page 20
Preliminary
2006 Microchip Technology Inc.
8-Lead Plastic Dual-Flat, No-Lead Package (MC) 2x3x0.9 mm Body (DFN) – Saw Singulated
L
E2
A3
A1
A
TOP VIEW
D
E
EXPOSED
METAL
PAD
D2
BOTTOM VIEW
2
1
b
p
n
(
NOTE 3
)
ETIE BAR
PIN 1
(
NOTE 1
)
ID IAREA
(
NOTE 2
)
CONFIGURATION
CONTACT
ALTERNATE
DETAIL
K
3.
Package may have one or more exposed tie bars at ends.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
REF: Reference Dimension, usually without tolerance, for information purposes only.
See ASME Y14.5M
JEDEC Equivalent MO-229 VCED-2
DWG No. C04-123
MILLIMETERS
*
NOM
0.50 BSC
2.00 BSC
3.00 BSC
0.20 REF.
1.
Pin 1 visual index feature may vary, but must be located within the hatched area.
2.
Exposed pad may vary according to die attach paddle size.
.039
.002
.035
.001
.031
.000
0.80
0.00
A
A1
Overall Height
Standoff
Contact Thickness
*
Controlling Parameter
**
Not within JEDEC parameters
§
Significant Characteristic
Contact Length §
Contact-to-Exposed Pad
Notes:
Contact Width
Overall Width
Exposed Pad Length
Overall Length
Exposed Pad Width
.010
.008
L
K
b
.012
0.20
.008 REF.
.079 BSC
.118 BSC
–
–
D
E
.051
.059
.012
.008
D2
E2
A3
.069
.075
.020
1.30
**
1.50
**
0.30
0.20
Dimension Limits
Pitch
Number of Pins
INCHES
NOM
.020 BSC
MIN
n
e
Units
8
MAX
MIN
1.00
0.05
0.90
0.02
0.25
0.30
–
–
1.75
1.90
0.50
8
MAX
§
.016
0.40
–
–
–
–
Revised 09-12-05
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PDF描述
25AA020A 2K SPI Bus Serial EEPROM
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25AA080 8K/16K 1.8V SPI Bus Serial EEPROM
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
25LC010A/S16K 制造商:Microchip Technology Inc 功能描述:1K, 128 X 8, 2.5V SER EE, DIE - Gel-pak, waffle pack, wafer, diced wafer on film
25LC010A/W16K 制造商:Microchip Technology Inc 功能描述:1K, 128 X 8, 2.5V SER EE, WAFER - Gel-pak, waffle pack, wafer, diced wafer on film
25LC010A/WF16K 制造商:Microchip Technology Inc 功能描述:1K, 128 X 8, 2.5V SER EE, WAF - Gel-pak, waffle pack, wafer, diced wafer on film
25LC010A_09 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:1K-4K SPI Serial EEPROM High Temp Family Data Sheet
25LC010A-E/MC 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:1K SPI Bus Serial EEPROM
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