參數(shù)資料
型號(hào): 25LC010A
廠商: Microchip Technology Inc.
英文描述: 1K SPI Bus Serial EEPROM
中文描述: 每1000 SPI總線串行EEPROM
文件頁(yè)數(shù): 18/28頁(yè)
文件大?。?/td> 362K
代理商: 25LC010A
25AA010A/25LC010A
DS21832C-page 18
Preliminary
2006 Microchip Technology Inc.
8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)
α
A2
A
A1
L
c
β
φ
1
2
D
n
p
B
E
E1
10°
10°
β
Mold Draft Angle Bottom
*
Controlling Parameter
10°
10°
α
Mold Draft Angle Top
0.30
0.25
0.19
.012
.010
.007
B
Lead Width
0.20
0.15
0.09
.008
.006
.004
c
Lead Thickness
0.70
0.60
0.50
.028
.024
.020
L
φ
Foot Length
Foot Angle
3.10
3.00
2.90
.122
.118
.114
D
Molded Package Length
4.50
4.40
4.30
.177
.173
.169
E1
Molded Package Width
6.50
6.38
6.25
.256
.251
.246
E
Overall Width
0.15
0.10
0.05
.006
.004
.002
A1
Standoff
0.95
0.90
0.85
.037
.035
.033
A2
Molded Package Thickness
1.10
1.05
1.00
.043
.041
.039
A
Overall Height
0.65
.026
p
Pitch
8
8
n
Number of Pins
MAX
NOM
MIN
MAX
NOM
MIN
Dimension Limits
MILLIMETERS
*
INCHES
Units
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side.
JEDEC Equivalent: MO-153
Drawing No. C04-086
Notes:
Revised 07-21-05
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