- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄41446 > 2N6519RL (ON SEMICONDUCTOR) 500 mA, 300 V, PNP, Si, SMALL SIGNAL TRANSISTOR, TO-92 PDF資料下載
參數(shù)資料
| 型號： | 2N6519RL |
| 廠商： | ON SEMICONDUCTOR |
| 元件分類： | 小信號晶體管 |
| 英文描述： | 500 mA, 300 V, PNP, Si, SMALL SIGNAL TRANSISTOR, TO-92 |
| 封裝： | PLASTIC, TO-226AA, 3 PIN |
| 文件頁數(shù)： | 24/37頁 |
| 文件大?。?/td> | 430K |
| 代理商： | 2N6519RL |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁當(dāng)前第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁
9–15
Reliability and Quality Assurance
Motorola Small–Signal Transistors, FETs and Diodes Device Data
RELIABILITY STRESS TESTS
The following are brief descriptions of the reliability tests
commonly used in the reliability monitoring program. Not all of
the tests listed are performed by each product division. Other
tests may be performed when appropriate.
AUTOCLAVE (aka, PRESSURE COOKER)
Autoclave is an environmental test which measures device
resistance to moisture penetration and the resultant effect of
galvanic corrosion. Autoclave is a highly accelerated and
destructive test.
Typical Test Conditions: TA = 121°C, rh = 100%, p = 1
atmosphere (15 psig), t = 24 to 96 hours
Common Failure Modes: Parametric shifts, high leak-
age and/or catastrophic
Common Failure Mechanisms: Die corrosion or con-
taminants such as foreign material on or within the pack-
age materials. Poor package sealing.
HIGH HUMIDITY HIGH TEMPERATURE
BIAS (H3TB, H3TRB, or THB)
This is an environmental test designed to measure the
moisture resistance of plastic encapsulated devices. A bias is
applied to create an electrolytic cell necessary to accelerate
corrosion of the die metallization. With time, this is a
catastrophically destructive test.
Typical Test Conditions: TA = 85°C to 95°C, rh = 85%
to 95%, Bias = 80% to 100% of Data Book max. rating, t
= 96 to 1750 hours
Common Failure Modes: Parametric shifts, high leak-
age and/or catastrophic
Common Failure Mechanisms: Die corrosion or con-
taminants such as foreign material on or within the pack-
age materials. Poor package sealing.
HIGH TEMPERATURE GATE BIAS (HTGB)
This test is designed to electrically stress the gate oxide under
a bias condition at high temperature.
Typical Test Conditions: TA = 150°C, Bias = 80% of
Data Book max. rating, t = 120 to 1000 hours
Common Failure Modes: Parametric shifts in gate leak-
age and gate threshold voltage
Common Failure Mechanisms: Random oxide defects
and ionic contamination
Military Reference: MIL–STD–750, Method 1042
HIGH TEMPERATURE REVERSE BIAS
(HTRB)
The purpose of this test is to align mobile ions by means of
temperature and voltage stress to form a high–current
leakage path between two or more junctions.
Typical Test Conditions: TA = 85°C to 150°C, Bias =
80% to 100% of Data Book max. rating, t = 120 to 1000
hours
Common Failure Modes: Parametric shifts in leakage
and gain
Common Failure Mechanisms: Ionic contamination on
the surface or under the metallization of the die
Military Reference: MIL–STD–750, Method 1039
HIGH TEMPERATURE STORAGE LIFE
(HTSL)
High temperature storage life testing is performed to
accelerate failure mechanisms which are thermally activated
through the application of extreme temperatures
Typical Test Conditions: TA = 70°C to 200°C, no bias, t
= 24 to 2500 hours
Common Failure Modes: Parametric shifts in leakage
and gain
Common Failure Mechanisms: Bulk die and diffusion
defects
Military Reference: MIL–STD–750, Method 1032
INTERMITTENT OPERATING LIFE (IOL)
The purpose of this test is the same as SSOL in addition to
checking the integrity of both wire and die bonds by means of
thermal stressing
Typical Test Conditions: TA = 25°C, Pd = Data Book
maximum rating, Ton = Toff = D of 50°C to 100°C, t = 42
to 30000 cycles
Common Failure Modes: Parametric shifts and cata-
strophic
Common Failure Mechanisms: Foreign material, crack
and bulk die defects, metallization, wire and die bond
defects
Military Reference: MIL–STD–750, Method 1037
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| 2N6519RLRA | 500 mA, 300 V, PNP, Si, SMALL SIGNAL TRANSISTOR, TO-92 |
| 2N6519 | 500 mA, PNP, Si, SMALL SIGNAL TRANSISTOR, TO-92 |
| 2N5221 | 600 mA, PNP, Si, SMALL SIGNAL TRANSISTOR, TO-92 |
| 2N4058 | 50 mA, PNP, Si, SMALL SIGNAL TRANSISTOR, TO-92 |
| 2N4971 | 600 mA, PNP, Si, SMALL SIGNAL TRANSISTOR, TO-92 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 2N6519RLRA | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| 2N6519TA | 功能描述:兩極晶體管 - BJT PNP Si Transistor Epitaxial RoHS:否 制造商:STMicroelectronics 配置: 晶體管極性:PNP 集電極—基極電壓 VCBO: 集電極—發(fā)射極最大電壓 VCEO:- 40 V 發(fā)射極 - 基極電壓 VEBO:- 6 V 集電極—射極飽和電壓: 最大直流電集電極電流: 增益帶寬產(chǎn)品fT: 直流集電極/Base Gain hfe Min:100 A 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PowerFLAT 2 x 2 |
| 2N6519TA_Q | 功能描述:兩極晶體管 - BJT PNP Si Transistor Epitaxial RoHS:否 制造商:STMicroelectronics 配置: 晶體管極性:PNP 集電極—基極電壓 VCBO: 集電極—發(fā)射極最大電壓 VCEO:- 40 V 發(fā)射極 - 基極電壓 VEBO:- 6 V 集電極—射極飽和電壓: 最大直流電集電極電流: 增益帶寬產(chǎn)品fT: 直流集電極/Base Gain hfe Min:100 A 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PowerFLAT 2 x 2 |
| 2N651A | 制造商: 功能描述: 制造商:Motorola Inc 功能描述: 制造商:undefined 功能描述: |
| 2N651AJ | 制造商:Motorola Inc 功能描述: |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。