參數資料
型號： 4-87022-3
廠商： Tyco Electronics
元件分類： 電路板相疊連接器
英文描述： Contacts–AMPMODU Machine Applied
中文描述： 接觸體－適用AMPMODU機器
文件頁數： 87/96頁
文件大小： 3917K
代理商： 4-87022-3
172
Catalog 1307819
Dimensions are in inches and
Dimensions are shown for
USA: 1-800-522-6752
South America: 55-11-2103-6000
Revised 8-08
millimeters unless otherwise
reference purposes only.
Canada: 1-905-470-4425
Hong Kong: 852-2735-1628
specified. Values in brackets
Specifications subject
Mexico: 01-800-733-8926
Japan: 81-44-844-8013
www.tycoelectronics.com
are metric equivalents.
to change.
C. America: 52-55-1106-0803
UK: 44-8706-080-208
Mod II Receptacle Assemblies, Single-Row, Surface Mount
.100 [2.54] Centerline
AMPMODU Interconnection System
Note: All part numbers are RoHS compliant.
Horizontal
Mount,
Receptacle
Assemblies
5
Closed Entry, End Stackable,
Short Point-of-Contact,
with Standoffs
Part No. 86286-1
(Plugs into receptacle contact)
Material — Natural color nylon
Keying Plug
Material and Finish
Housing — Glass-filled thermoplastic,
black, 94V-0 rated
Contacts — Phosphor bronze,
plated as follows:
Plating A — Duplex .000030
[0.00076] gold on contact area,
.000150-.000300 [0.00381-0.00762]
matte tin on solder area all over .000050
[0.00127] nickel
Plating B — Duplex .000010
[0.000254] gold on contact area,
.000150-.000300 [0.00381-0.00762]
matte tin on solder area all over .000050
[0.00127] nickel
Plating C — .000150-.000300
[0.00381-0.00762] matte tin on solder
leads, all over .000050 [0.00127] nickel
Related Product Data
Mateable Headers —
Refer to the Mating Post Selection
Guide — page 90
Performance Characteristics —
page 171
Technical Documents — page 276
Product Specification
108-25026
Application Specification
114-25018
Additional receptacle assembly
sizes are available; minimum order
quantities may apply. Consult
Tyco Electronics.
A
.050
[1.27]
X
Section X–X
X
.100
[2.54]
Typ.
.008
.005
[0.20]
[0.13]
Typ.
.100
[2.54]
Typ.
.320
[8.13]
.174
Max.
[4.42]
(Point-of-Contact)
.060
Typ.
[1.52]
.090
Typ.
[2.29]
.069
[1.75]
.137
[3.48]
.356
[9.04]
.388±.010
[9.85±0.25]
Pos. No.
Ref. Typ.
No. of
Dimension
Contact Plating/Part Nos.
Pos.
A
Plating A
Plating B
Plating C
2
.200
[5.08]
5147721-1
5147732-1
5147733-1
3
.300
[7.62]
5147721-2
5147732-2
5147733-2
4
.400 [10.16]
5147721-3
5147732-3
5147733-3
5
.500 [12.70]
5147721-4
5147732-4
5147733-4
6
.600 [15.24]
5147721-5
5147732-5
5147733-5
7
.700 [17.78]
5147721-6
5147732-6
5147733-6
8
.800 [20.32]
5147721-7
5147732-7
5147733-7
9
.900 [22.86]
5147721-8
5147732-8
5147733-8
10
1.000 [25.40]
5147721-9
5147732-9
5147733-9
11
1.100 [27.94]
1-5147721-0
1-5147732-0
1-5147733-0
12
1.200 [30.48]
1-5147721-1
1-5147732-1
1-5147733-1
13
1.300 [33.02]
1-5147721-2
1-5147732-2
1-5147733-2
14
1.400 [35.56]
1-5147721-3
1-5147732-3
1-5147733-3
15
1.500 [38.10]
1-5147721-4
1-5147732-4
1-5147733-4
16
1.600 [40.64]
1-5147721-5
1-5147732-5
1-5147733-5
17
1.700 [43.18]
1-5147721-6
1-5147732-6
1-5147733-6
18
1.800 [45.72]
1-5147721-7
1-5147732-7
1-5147733-7
19
1.900 [48.26]
1-5147721-8
1-5147732-8
1-5147733-8
20
2.000 [50.80]
1-5147721-9
1-5147732-9
1-5147733-9
30
3.000 [76.20]
2-5147721-9
2-5147732-9
2-5147733-9
40
4.000[101.60]
3-5147721-9
3-5147732-9
3-5147733-9
Recommended Etched Circuit Layout
(for .040 [1.02] min. thick PC Board;
.008 [0.20] thick stencil)
(Localized Gold
Plate Area)
.125
[3.18]
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