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參數(shù)資料
| 型號： | 534AB000359DG |
| 廠商： | Silicon Laboratories Inc |
| 文件頁數(shù)： | 8/12頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC CLK XO QUAD FREQUENCY 8SMD |
| 應(yīng)用說明： | Frequency Margining using the SI534 |
| 標(biāo)準(zhǔn)包裝： | 50 |
| 系列： | Si534 |
| 類型： | 振蕩器 - 晶體 |
| 頻率： | 167.33MHz，173.37MHz，193.77MHz，194.89MHz |
| 電源電壓： | 1.71 V ~ 3.63 V |
| 電流 - 電源： | 111mA |
| 工作溫度： | -40°C ~ 85°C |
| 封裝/外殼： | 8-SMD，無引線 |
| 包裝： | 托盤 |
| 供應(yīng)商設(shè)備封裝： | 8-SMD |
| 安裝類型： | 表面貼裝 |
| 其它名稱： | Q4733547A |
Si534
Rev. 1.3
5
Table 7. Environmental Compliance
The Si534 meets the following qualification test requirements.
Parameter
Conditions/Test Method
Mechanical Shock
MIL-STD-883, Method 2002
Mechanical Vibration
MIL-STD-883, Method 2007
Solderability
MIL-STD-883, Method 2003
Gross & Fine Leak
MIL-STD-883, Method 1014
Resistance to Solder Heat
MIL-STD-883, Method 2036
Moisture Sensitivity Level
J-STD_020, MSL1
Contact Pads
Gold over Nickel
Table 8. Thermal Characteristics
(Typical values TA = 25 C, VDD =3.3 V)
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Thermal Resistance Junction to Ambient
JA
Still Air
—
84.6
—
°C/W
Thermal Resistance Junction to Case
JC
Still Air
—
38.8
—
°C/W
Ambient Temperature
TA
–40
—
85
°C
Junction Temperature
TJ
——
125
°C
Table 9. Absolute Maximum Ratings1
Parameter
Symbol
Rating
Units
Maximum Operating Temperature
TAMAX
85
C
Supply Voltage, 1.8 V Option
VDD
–0.5 to +1.9
V
Supply Voltage, 2.5/3.3 V Option
VDD
–0.5 to +3.8
V
Input Voltage (any input pin)
VI
–0.5 to VDD + 0.3
V
Storage Temperature
TS
–55 to +125
C
ESD Sensitivity (HBM, per JESD22-A114)
ESD
2000
V
Soldering Temperature (Pb-free profile)2
TPEAK
260
C
Soldering Temperature Time @ TPEAK (Pb-free profile)
2
tP
20–40
seconds
Notes:
1. Stresses beyond those listed in Absolute Maximum Ratings may cause permanent damage to the device. Functional
operation or specification compliance is not implied at these conditions. Exposure to maximum rating conditions for
extended periods may affect device reliability.
www.silabs.com/VCXO for further information, including soldering profiles.
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