參數(shù)資料
型號(hào)： 5962-8967602QX
廠商： MAXIM INTEGRATED PRODUCTS INC
元件分類： ADC
英文描述： 1-CH 16-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL/PARALLEL ACCESS, CDIP40
封裝： CERAMIC, DIP-40
文件頁(yè)數(shù)： 12/35頁(yè)
文件大?。?/td> 3744K
代理商： 5962-8967602QX
MAX5723/MAX5724/MAX5725
Ultra-Small, Octal-Channel, 8-/10-/12-Bit Buffered
Output DACs with Internal Reference and SPI Interface
2
Maxim Integrated
VDD, VDDIO to GND ................................................-0.3V to +6V
OUT_, REF to GND....0.3V to the lower of (VDD + 0.3V) and +6V
SCLK, CSB, IRQ, M/Z, LDAC, CLR to GND...........-0.3V to +6V
DIN, DOUT to GND .....................................-0.3V to the lower of
(VDDIO + 0.3V) and +6V
Continuous Power Dissipation (TA = +70NC)
TSSOP (derate at 13.6mW/NC above 70NC)..............1084mW
WLP (derate at 21.3mW/NC above 70NC)..................1700mW
Maximum Continuous Current into Any Pin .................... Q50mA
Operating Temperature.................................... -40NC to +125NC
Storage Temperature ....................................... -65NC to +150NC
Lead Temperature (TSSOP only)(soldering, 10s)...........+300NC
Soldering Temperature (reflow) .................................... +260NC
TSSOP
Junction-to-Ambient Thermal Resistance (θJA) ......73.8NC/W
Junction-to-Case Thermal Resistance (θJC) ..............20NC/W
WLP
Junction-to-Ambient Thermal Resistance (θJA)
(Note 2) ...................................................................47NC/W
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Note 2: Visit www.maximintegrated.com/app-notes/index.mvp/id/1891 for information about the thermal performance of WLP packaging.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
ELECTRICAL CHARACTERISTICS
(VDD = 2.7V to 5.5V, VDDIO = 1.8V to 5.5V, VGND = 0V, CL = 200pF, RL = 2kI, TA = -40NC to +125NC, unless otherwise noted.)
(Note 3)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
DC PERFORMANCE (Note 4)
Resolution and Monotonicity
N
MAX5723
8
Bits
MAX5724
10
MAX5725
12
Integral Nonlinearity (Note 5)
INL
MAX5723
-0.25
Q
0.05
+0.25
LSB
MAX5724
-0.5
Q
0.2
+0.5
MAX5725
-1
Q
0.5
+1
Differential Nonlinearity (Note 5)
DNL
MAX5723
-0.25
Q
0.05
+0.25
LSB
MAX5724
-0.5
Q
0.1
+0.5
MAX5725
-1
Q
0.2
+1
Offset Error (Note 6)
OE
-5
Q
0.5
+5
mV
Offset Error Drift
Q
10
F
V/NC
Gain Error (Note 6)
GE
-1.0
Q
0.1
+1.0
%FS
Gain Temperature Coefficient
With respect to VREF
Q
3.0
ppm of
FS/NC
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