參數(shù)資料
型號(hào): 74LV74PW,118
廠(chǎng)商: NXP Semiconductors
文件頁(yè)數(shù): 7/19頁(yè)
文件大小: 0K
描述: IC DUAL D FF POSEDG TRIG 14TSSOP
產(chǎn)品培訓(xùn)模塊: Logic Packages
標(biāo)準(zhǔn)包裝: 2,500
系列: 74LV
功能: 設(shè)置(預(yù)設(shè))和復(fù)位
類(lèi)型: D 型
輸出類(lèi)型: 差分
元件數(shù): 2
每個(gè)元件的位元數(shù): 1
頻率 - 時(shí)鐘: 56MHz
觸發(fā)器類(lèi)型: 正邊沿
輸出電流高,低: 12mA,12mA
電源電壓: 1 V ~ 5.5 V
工作溫度: -40°C ~ 125°C
安裝類(lèi)型: 表面貼裝
封裝/外殼: 14-TSSOP(0.173",4.40mm 寬)
包裝: 帶卷 (TR)
74LV74
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 3 — 9 September 2013
15 of 19
NXP Semiconductors
74LV74
Dual D-type flip-flop with set and reset; positive-edge trigger
Fig 12. Package outline SOT402-1 (TSSOP14)
UNIT
A1
A2
A3
bp
cD (1)
E (2)
(1)
eHE
LLp
QZ
y
w
v
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
0.65
6.6
6.2
0.4
0.3
0.72
0.38
8
0
o
0.13
0.1
0.2
1
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT402-1
MO-153
99-12-27
03-02-18
w M
b p
D
Z
e
0.25
17
14
8
θ
A
A1
A2
L p
Q
detail X
L
(A )
3
HE
E
c
v M A
X
A
y
0
2.5
5 mm
scale
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm
SOT402-1
A
max.
1.1
pin 1 index
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