參數(shù)資料
型號(hào): 934024210135
廠商: NXP SEMICONDUCTORS
元件分類: 二極管(射頻、小信號(hào)、開(kāi)關(guān)、功率)
英文描述: 0.4 A, 600 V, SILICON, SIGNAL DIODE
封裝: HERMETIC SEALED, GLASS, 100H03, 2 PIN
文件頁(yè)數(shù): 9/14頁(yè)
文件大小: 113K
代理商: 934024210135
1999 Nov 11
4
Philips Semiconductors
Product specication
Ultra-fast soft-recovery
controlled avalanche rectiers
BYD57 series
THERMAL CHARACTERISTICS
Note
1. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer
≥40 m, see Fig.17.
For more information please refer to the
‘General Part of associated Handbook’.
maximum slope of reverse recovery
current
when switched from
IF = 1 AtoVR ≥ 30 V and
dIF/dt = 1A/s;
see Fig.19
BYD57D to J
7A/
s
BYD57K and M
6A/
s
BYD57U and V
5A/
s
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
Rth j-tp
thermal resistance from junction to tie-point
30
K/W
Rth j-a
thermal resistance from junction to ambient
note 1
150
K/W
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
dI
R
dt
--------
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