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參數(shù)資料
| 型號： | 934056834112 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 功率晶體管 |
| 英文描述： | L BAND, Si, N-CHANNEL, RF POWER, MOSFET |
| 封裝： | CERAMIC PACKAGE-2 |
| 文件頁數(shù)： | 5/8頁 |
| 文件大小： | 64K |
| 代理商： | 934056834112 |
2002 Oct 02
5
Philips Semiconductors
Product specication
Avionics LDMOS transistor
BLA1011-2
handbook, full pagewidth
MGU487
60
110
C1
C2
C3
C4
C5
C6
C7
C8
C9
C10
C11
R1
R2
41
7
7.5
13.5
5
Dimensions in mm.
The components are situated on one side of the Rogers 6010 printed-circuit board (thickness = 0.64 mm;
εr = 6.2), the other side is unetched
and serves as a ground plane. Earth connections from the component side to the ground plane are made by through-metallization.
Fig.6 Printed-circuit board for class-AB test circuit.
List of components for class-AB test circuit (see Fig.6)
Notes
1. American Technical Ceramics type 100A or capacitor of same quality.
2. American Technical Ceramics type 200B or capacitor of same quality.
3. American Technical Ceramics type 100B or capacitor of same quality.
COMPONENT
DESCRIPTION
VALUE
C1, C8
multilayer ceramic chip capacitor; note 1
56 pF
C2
multilayer ceramic chip capacitor; note 1
7.5 pF
C3
multilayer ceramic chip capacitor; note 1
1.8 pF
C4, C10
multilayer ceramic chip capacitor; note 2
20 nF
C5
multilayer ceramic chip capacitor; note 3
33 pF
C6
multilayer ceramic chip capacitor; note 1
5.6 pF
C7
multilayer ceramic chip capacitor; note 3
6.2 pF
C9
tekelec trimmer; type 37283
0.4 to 2.5 pF
C11
multilayer ceramic chip capacitor; note 1
33 pF
R1
SMD resistor
2.2
(2 in parallel)
R2
SMD resistor
22
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