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參數(shù)資料
| 型號： | 934056997215 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 小信號晶體管 |
| 英文描述： | 475 mA, 60 V, N-CHANNEL, Si, SMALL SIGNAL, MOSFET, TO-236AB |
| 封裝： | PLASTIC, SMD, SST3, 3 PIN |
| 文件頁數(shù)： | 6/11頁 |
| 文件大?。?/td> | 276K |
| 代理商： | 934056997215 |
Philips Semiconductors
2N7002F
TrenchMOS Logic Level FET
Product data
Rev. 01 — 11 February 2002
4 of 11
9397 750 09096
Koninklijke Philips Electronics N.V. 2002. All rights reserved.
7.
Thermal characteristics
7.1 Transient thermal impedance
Table 4:
Thermal characteristics
Symbol Parameter
Conditions
Min Typ Max Unit
Rth(j-sp)
thermal resistance from junction to solder point mounted on a metal clad board; Figure 4
-
150
K/W
Rth(j-a)
thermal resistance from junction to ambient
mounted on a printed circuit board;
minimum footprint
-
350
K/W
Mounted on metal clad substrate.
Fig 4.
Transient thermal impedance from junction to solder point as a function of pulse duration.
03ai09
10-1
1
10
102
103
10-5
10-4
10-3
10-2
10-1
1
10
tp (s)
Zth(j-sp)
K/W
single pulse
0.2
0.1
0.05
0.02
δ = 0.5
tp
T
P
t
T
δ =
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