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參數(shù)資料
| 型號： | 935264403005 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 無繩電話/電話 |
| 英文描述： | TELEPHONE SPEECH CKT, UUC17 |
| 封裝： | DIE-17 |
| 文件頁數(shù)： | 4/30頁 |
| 文件大?。?/td> | 178K |
| 代理商： | 935264403005 |
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2000 Feb 18
12
Philips Semiconductors
Product specication
Speech circuit with dialler interface, regulated
supply and earpiece volume control
TEA1111A
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
Note
1. Mostly dependent on the maximum required ambient temperature, on the voltage between LN and SLPE and on the
thermal resistance between die ambient temperature. This thermal resistance depends on the application board
layout and on the materials used. Figure 13 shows the safe operating area versus this thermal resistance for ambient
temperature Tamb =75 °C
THERMAL CHARACTERISTICS
Note
1. Mounted on epoxy board 40.1
× 19.1 × 1.5 mm.
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VLN
positive continuous line voltage
VEE 0.4 12
V
repetitive line voltage during switch-on or
line interruption
VEE 0.4 13.2
V
IDD
maximum input current at pin VDD
75
mA
VCC
supply voltage
VEE 0.4 12
V
VMUTE,VVCI maximum voltage on pins MUTE and VCI
VEE 0.4 VDD + 0.4 V
Vn(max)
maximum voltage on all pins except
pins VDD, MUTE and VCI
VEE 0.4 VCC + 0.4 V
Iline
line current
RSLPE =20 ; see Fig.12
140
mA
Ptot
total power dissipation
Tamb =75 °C
TEA1111AT; (see Fig.12)
400
mW
TEA1111AUH; note 1
mW
Tstg
storage temperature
40
+125
°C
Tamb
ambient temperature
25
+75
°C
Tj
junction temperature
+125
°C
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
Rth(j-a)
thermal resistance from junction to ambient
in free air; note 1
TEA1111AT
110
K/W
TEA1111AUH
tbf by customer
in application
K/W
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