參數(shù)資料
型號(hào)： 935285129118
廠商： NXP SEMICONDUCTORS
元件分類： 顯示驅(qū)動(dòng)器
英文描述： LED DISPLAY DRIVER, PDSO28
封裝： 4.40 MM, PLASTIC, MO-153, SOT361-1, TSSOP-28
文件頁(yè)數(shù)： 41/54頁(yè)
文件大?。?/td> 410K
代理商： 935285129118
PCA9685_2
NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 16 July 2009
46 of 50
NXP Semiconductors
PCA9685
16-channel, 12-bit PWM Fm+ I2C-bus LED controller
Process issues, such as application of adhesive and ux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specications, including temperature and impurities
17.4 Reow soldering
Key characteristics in reow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reow process usually leads to
higher minimum peak temperatures (see Figure 38) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reow temperature prole; this prole includes preheat, reow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classied in accordance with
Table 16 and 17
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reow
soldering, see Figure 38.
Table 16.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
Table 17.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
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