- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄360619 > 93LC56C (Microchip Technology Inc.) 2K Microwire Compatible Serial EEPROM PDF資料下載
參數(shù)資料
| 型號： | 93LC56C |
| 廠商： | Microchip Technology Inc. |
| 元件分類： | EEPROM |
| 英文描述： | 2K Microwire Compatible Serial EEPROM |
| 中文描述： | 2K微絲兼容串行EEPROM |
| 文件頁數(shù)： | 18/28頁 |
| 文件大?。?/td> | 357K |
| 代理商： | 93LC56C |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁當(dāng)前第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁
93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C
DS21794E-page 18
2007 Microchip Technology Inc.
8-Lead Plastic Small Outline (SN or OA) – Narrow, 3.90 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
MILLIMETERS
NOM
8
1.27 BSC
–
–
–
6.00 BSC
3.90 BSC
4.90 BSC
–
–
1.04 REF
–
–
–
–
–
Dimension Limits
MIN
MAX
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
§
Overall Width
Molded Package Width
Overall Length
Chamfer (optional)
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
N
e
A
A2
A1
E
E1
D
h
L
L1
φ
c
b
α
β
–
1.75
–
0.25
1.25
0.10
0.25
0.40
0.50
1.27
0°
8°
0.17
0.31
5°
5°
0.25
0.51
15°
15°
D
N
e
E
E1
NOTE 1
1
2
3
b
A
A1
A2
L
L1
c
h
h
φ
β
α
Microchip Technology Drawing C04-057B
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| 93LC66B | 4K 2.5V Microwire Serial EEPROM |
| 93LC66B | 4K 2.5V Microwire Serial EEPROM(4K位,2.5V,具上掉電數(shù)據(jù)保護(hù)電路,Microwire接口EEPROM) |
| 93LC66A | 4K 2.5V Microwire Serial EEPROM(4K位,2.5V,具上掉電數(shù)據(jù)保護(hù)電路,Microwire接口EEPROM) |
| 93LC66 | 4K 2.0V CMOS Serial EEPROM(4K位,2.0V,具上掉電數(shù)據(jù)保護(hù)電路,EEPROM) |
| 93LC46 | 1K 2.0V CMOS Serial EEPROM(1K位,2.0V,具上掉電數(shù)據(jù)保護(hù)電路,EEPROM) |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 93LC56C/S15K | 制造商:Microchip Technology Inc 功能描述:2K, 256 X 8 OR 128 X 16 SERIAL - Gel-pak, waffle pack, wafer, diced wafer on film |
| 93LC56C/W15K | 制造商:Microchip Technology Inc 功能描述:2K, 256 X 8 OR 128 X 16 SERIAL - Gel-pak, waffle pack, wafer, diced wafer on film |
| 93LC56C/WF15K | 制造商:Microchip Technology Inc 功能描述:2K, 256 X 8 OR 128 X 16 SERIAL - Gel-pak, waffle pack, wafer, diced wafer on film |
| 93LC56C-E/CH | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:1K-16K Microwire Compatible Serial EEPROMs |
| 93LC56C-E/MC | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:1K-16K Microwire Compatible Serial EEPROMs |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。