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參數(shù)資料
| 型號： | 93LC56C |
| 廠商： | Microchip Technology Inc. |
| 元件分類： | EEPROM |
| 英文描述： | 2K Microwire Compatible Serial EEPROM |
| 中文描述： | 2K微絲兼容串行EEPROM |
| 文件頁數(shù)： | 20/28頁 |
| 文件大?。?/td> | 357K |
| 代理商： | 93LC56C |
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93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C
DS21794E-page 20
2007 Microchip Technology Inc.
8-Lead Plastic Dual Flat, No Lead Package (MC) – 2x3x0.9 mm Body [DFN]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. Package is saw singulated.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
MILLIMETERS
NOM
8
0.50 BSC
0.90
0.02
0.20 REF
2.00 BSC
3.00 BSC
–
–
0.25
0.40
–
Dimension Limits
MIN
MAX
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Length
Overall Width
Exposed Pad Length
Exposed Pad Width
Contact Width
Contact Length
Contact-to-Exposed Pad
N
e
A
A1
A3
D
E
D2
E2
b
L
K
0.80
0.00
1.00
0.05
1.30
1.50
0.18
0.30
0.20
1.75
1.90
0.30
0.50
–
D
N
E
NOTE 1
1
2
EXPOSED PAD
NOTE 1
2
1
D2
K
L
E2
N
e
b
A
3
A1
A
NOTE 2
BOTTOM VIEW
TOP VIEW
Microchip Technology Drawing C04-123B
相關PDF資料 |
PDF描述 |
|---|---|
| 93LC66B | 4K 2.5V Microwire Serial EEPROM |
| 93LC66B | 4K 2.5V Microwire Serial EEPROM(4K位,2.5V,具上掉電數(shù)據(jù)保護電路,Microwire接口EEPROM) |
| 93LC66A | 4K 2.5V Microwire Serial EEPROM(4K位,2.5V,具上掉電數(shù)據(jù)保護電路,Microwire接口EEPROM) |
| 93LC66 | 4K 2.0V CMOS Serial EEPROM(4K位,2.0V,具上掉電數(shù)據(jù)保護電路,EEPROM) |
| 93LC46 | 1K 2.0V CMOS Serial EEPROM(1K位,2.0V,具上掉電數(shù)據(jù)保護電路,EEPROM) |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| 93LC56C/S15K | 制造商:Microchip Technology Inc 功能描述:2K, 256 X 8 OR 128 X 16 SERIAL - Gel-pak, waffle pack, wafer, diced wafer on film |
| 93LC56C/W15K | 制造商:Microchip Technology Inc 功能描述:2K, 256 X 8 OR 128 X 16 SERIAL - Gel-pak, waffle pack, wafer, diced wafer on film |
| 93LC56C/WF15K | 制造商:Microchip Technology Inc 功能描述:2K, 256 X 8 OR 128 X 16 SERIAL - Gel-pak, waffle pack, wafer, diced wafer on film |
| 93LC56C-E/CH | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:1K-16K Microwire Compatible Serial EEPROMs |
| 93LC56C-E/MC | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:1K-16K Microwire Compatible Serial EEPROMs |
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