參數(shù)資料
型號(hào): A14100A-1CQ256C
廠商: Microsemi SoC
文件頁(yè)數(shù): 34/90頁(yè)
文件大?。?/td> 0K
描述: IC FPGA 10K GATES 256-CQFP
標(biāo)準(zhǔn)包裝: 1
系列: ACT™ 3
LAB/CLB數(shù): 1377
輸入/輸出數(shù): 228
門數(shù): 10000
電源電壓: 4.5 V ~ 5.5 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 70°C
封裝/外殼: 256-BFCQFP,帶拉桿
供應(yīng)商設(shè)備封裝: 256-CQFP(75x75)
Accelerator Series FPGAs – ACT 3 Family
IV
Re vis i on 3
A14V40A Device
84-Pin Plastic Leaded Chip Carrier (PLCC)
–––
––
100-Pin Very Thin Quad Flatpack (VQFP)
–––
––
160-Pin Plastic Quad Flatpack (PQFP)
–––
––
176-Pin Thin Quad Flatpack (TQFP)
–––
––
A1460A Device
160-Pin Plastic Quad Flatpack (PQFP)
DD
––
176-Pin Thin Quad Flatpack (TQFP)
DD
––
196-Pin Ceramic Quad Flatpack (CQFP)
––
207-Pin Ceramic Pin Grid Array (CPGA)
DD
208-Pin Plastic Quad Flatpack (PQFP)
DD
––
225-Pin Plastic Ball Grid Array (BGA)
D
––
A14V60A Device
160-Pin Plastic Quad Flatpack (PQFP)
–––
––
176-Pin Thin Quad Flatpack (TQFP)
–––
––
208-Pin Plastic Quad Flatpack (PQFP)
–––
––
A14100A Device
208-Pin Power Quad Flatpack (RQFP)
DD
––
257-Pin Ceramic Pin Grid Array (CPGA)
DD
313-Pin Plastic Ball Grid Array (BGA)
DD
––
256-Pin Ceramic Quad Flatpack (CQFP)
––
A14V100A Device
208-Pin Power Quad Flatpack (RQFP)
–––
––
313-Pin Plastic Ball Grid Array (BGA)
–––
––
Device/Package
Speed Grade1
Application1
Std.
–1
–2
–3
C
I
M
B
Notes:
1. Applications:
C = Commercial
I = Industrial
M = Military
2. Commercial only
Availability:
= Available
P = Planned
– = Not planned
D = Discontinued
Speed Grade:
–1 = Approx. 15% faster than Std.
–2 = Approx. 25% faster than Std.
–3 = Approx. 35% faster than Std.
(–2 and –3 speed grades have
been discontinued.)
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