參數(shù)資料
型號(hào)： A40MX02-2PQ100I
廠商： Microsemi SoC
文件頁數(shù)： 110/142頁
文件大小： 0K
描述： IC FPGA MX SGL CHIP 3K 100-PQFP
標(biāo)準(zhǔn)包裝： 66
系列： MX
輸入/輸出數(shù)： 57
門數(shù)： 3000
電源電壓： 3 V ~ 3.6 V，4.5 V ~ 5.5 V
安裝類型： 表面貼裝
工作溫度： -40°C ~ 85°C
封裝/外殼： 100-BQFP
供應(yīng)商設(shè)備封裝： 100-PQFP（14x20）
40MX and 42MX FPGA Families
Re vi s i on 11
1-3
A42MX24 and A42MX36 devices contain D-modules, which are arranged around the periphery of the
device. D-modules contain wide-decode circuitry, providing a fast, wide-input AND function similar to that
found in CPLD architectures (Figure 1-4). The D-module allows A42MX24 and A42MX36 devices to
perform wide-decode functions at speeds comparable to CPLDs and PALs. The output of the D-module
has a programmable inverter for active HIGH or LOW assertion. The D-module output is hardwired to an
output pin, and can also be fed back into the array to be incorporated into other logic.
Dual-Port SRAM Modules
The A42MX36 device contains dual-port SRAM modules that have been optimized for synchronous or
asynchronous applications. The SRAM modules are arranged in 256-bit blocks that can be configured as
32x8 or 64x4. SRAM modules can be cascaded together to form memory spaces of user-definable width
and depth. A block diagram of the A42MX36 dual-port SRAM block is shown in Figure 1-5.
The A42MX36 SRAM modules are true dual-port structures containing independent read and write ports.
Each SRAM module contains six bits of read and write addressing (RDAD[5:0] and WRAD[5:0],
respectively) for 64x4-bit blocks. When configured in byte mode, the highest order address bits (RDAD5
and WRAD5) are not used. The read and write ports of the SRAM block contain independent clocks
(RCLK and WCLK) with programmable polarities offering active HIGH or LOW implementation. The
SRAM block contains eight data inputs (WD[7:0]), and eight outputs (RD[7:0]), which are connected to
segmented vertical routing tracks.
The A42MX36 dual-port SRAM blocks provide an optimal solution for high-speed buffered applications
requiring FIFO and LIFO queues. The ACTgen Macro Builder within Microsemi's Designer software
Figure 1-3
42MX S-Module Implementation
CLR
Up to 7-Input Function Plus D-Type Flip-Flop with Clear
Up to 4-Input Function Plus Latch with Clear
D0
D1
S
Y
D
Q
GATE
CLR
OUT
Up to 8-Input Function (Same as C-Module)
D00
D01
D10
D11
S1
S0
Y
OUT
Up to 7-Input Function Plus Latch
D00
D01
D10
D11
S1
S0
Y
OUT
GATE
D
Q
D00
D01
D10
D11
S1
S0
Y
D
Q
OUT
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
A40MX02-2PQ100M 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Field Programmable Gate Array (FPGA)
A40MX02-2PQG100 功能描述:IC FPGA MX SGL CHIP 3K 100-PQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:MX 標(biāo)準(zhǔn)包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA（17x17）
A40MX02-2PQG100I 功能描述:IC FPGA MX SGL CHIP 3K 100-PQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:MX 標(biāo)準(zhǔn)包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA（17x17）
A40MX02-2VQ80 功能描述:IC FPGA MX SGL CHIP 3K 80-VQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:MX 標(biāo)準(zhǔn)包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA（17x17）
A40MX02-2VQ80I 功能描述:IC FPGA MX SGL CHIP 3K 80-VQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:MX 標(biāo)準(zhǔn)包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA（17x17）
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