tCKH Input LOW to HIGH FO = 32" />
參數(shù)資料
型號: A42MX09-PL84
廠商: Microsemi SoC
文件頁數(shù): 122/142頁
文件大?。?/td> 0K
描述: IC FPGA MX SGL CHIP 14K 84-PLCC
標準包裝: 16
系列: MX
輸入/輸出數(shù): 72
門數(shù): 14000
電源電壓: 3 V ~ 3.6 V,4.75 V ~ 5.25 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 70°C
封裝/外殼: 84-LCC(J 形引線)
供應(yīng)商設(shè)備封裝: 84-PLCC(29.31x29.31)
40MX and 42MX FPGA Families
1- 76
R e v i sio n 1 1
Global Clock Network
tCKH
Input LOW to HIGH
FO = 32
FO = 635
2.7
3.0
3.3
3.4
3.8
4.0
4.4
5.6
6.2
ns
tCKL
Input HIGH to LOW
FO = 32
FO = 635
3.8
4.9
4.2
5.4
4.8
6.1
5.6
7.2
7.8
10.1
ns
tPWH
Minimum Pulse
Width HIGH
FO = 32
FO = 635
1.8
2.0
2.2
2.5
2.6
2.9
3.6
4.1
ns
tPWL
Minimum Pulse
Width LOW
FO = 32
FO = 635
1.8
2.0
2.2
2.5
2.6
2.9
3.6
4.1
ns
tCKSW
Maximum Skew
FO = 32
FO = 635
0.8
0.9
1.0
1.4
ns
tSUEXT
Input Latch External
Set-Up
FO = 32
FO = 635
0.0
ns
tHEXT
Input Latch External
Hold
FO = 32
FO = 635
2.8
3.3
3.2
3.7
3.6
4.2
4.9
5.9
6.9
ns
tP
Minimum Period
(1/fMAX)
FO = 32
FO = 635
5.5
6.0
6.1
6.6
7.2
7.6
8.3
12.7
13.8
ns
fMAX
Maximum
Datapath
Frequency
FO = 32
FO = 635
180
166
164
151
139
131
121
79
73
MHz
TTL Output Module Timing5
tDLH
Data-to-Pad HIGH
2.6
2.8
3.2
3.8
5.3
ns
tDHL
Data-to-Pad LOW
3.0
3.3
3.7
4.4
6.2
ns
tENZH
Enable Pad Z to HIGH
2.7
3.0
3.3
3.9
5.5
ns
tENZL
Enable Pad Z to LOW
3.0
3.3
3.7
4.3
6.1
ns
tENHZ
Enable Pad HIGH to Z
5.3
5.8
6.6
7.8
10.9
ns
Table 1-38 A42MX36 Timing Characteristics (Nominal 5.0 V Operation)
(Worst-Case Commercial Conditions, VCCA = 4.75 V, TJ = 70°C)
–3 Speed
–2 Speed
–1 Speed
Std Speed
–F Speed
Parameter / Description
Min. Max. Min. Max. Min. Max. Min. Max. Min.
Max. Units
Notes:
1. For dual-module macros, use tPD1 + tRD1 + tPDn, tCO + tRD1 + tPDn, or tPD1 + tRD1 + tSUD, whichever is appropriate.
2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for
estimating device performance. Post-route timing analysis or simulation is required to determine actual performance.
3. Data applies to macros based on the S-module. Timing parameters for sequential macros constructed from C-modules
can be obtained from the Timer utility.
4. Set-up and hold timing parameters for the Input Buffer Latch are defined with respect to the PAD and the D input.
External setup/hold timing parameters must account for delay from an external PAD signal to the G inputs. Delay from an
external PAD signal to the G input subtracts (adds) to the internal setup (hold) time.
5. Delays based on 35 pF loading.
相關(guān)PDF資料
PDF描述
A42MX16-FPQ208 IC FPGA MX SGL CHIP 24K 208-PQFP
A42MX16-FPQG208 IC FPGA MX SGL CHIP 24K 208-PQFP
A40MX02-2VQG80I IC FPGA MX SGL CHIP 3K 80-VQFP
A40MX02-2VQ80I IC FPGA MX SGL CHIP 3K 80-VQFP
A42MX16-FTQ176 IC FPGA MX SGL CHIP 24K 176-TQFP
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
A42MX09-PL84A 功能描述:IC FPGA MX SGL CHIP 14K 84-PLCC RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:MX 標準包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA(17x17)
A42MX09-PL84I 功能描述:IC FPGA MX SGL CHIP 14K 84-PLCC RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:MX 標準包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA(17x17)
A42MX09-PL84M 制造商:Microsemi Corporation 功能描述:FPGA 14K GATES 336 CELLS 129MHZ/215MHZ 0.45UM 3.3V/5V 84PLCC - Rail/Tube 制造商:Microsemi Corporation 功能描述:IC FPGA 72 I/O 84PLCC 制造商:Microsemi Corporation 功能描述:IC FPGA MX SGL CHIP 14K 84-PLCC
A42MX09-PLG84 功能描述:IC FPGA 104I/O 84PLCC RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:MX 標準包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA(17x17)
A42MX09-PLG84A 功能描述:IC FPGA MX SGL CHIP 14K 84-PLCC RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:MX 標準包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA(17x17)