參數(shù)資料
型號: A54SX32-2BG329I
英文描述: Field Programmable Gate Array (FPGA)
中文描述: 現(xiàn)場可編程門陣列(FPGA)
文件頁數(shù): 26/36頁
文件大小: 833K
代理商: A54SX32-2BG329I
54SX Family FPGAs RadTolerant and HiRel
26
v2.0
Pin Description
CLKA,
CLKB
These pins are clock inputs for clock distribution networks.
Input levels are compatible with standard TTL or LVTTL
specifications. The clock input is buffered prior to clocking
the R-cells. If not used, this pin must be set LOW or HIGH on
the board. It must not be left floating.
Clock A and B
GND
LOW supply voltage.
Ground
HCLK
Dedicated (Hard-wired)
Array Clock
This pin is the clock input for sequential modules. Input
levels are compatible with standard TTL or LVTTL
specifications. This input is directly wired to each R-cell and
offers clock speeds independent of the number of R-cells
being driven. If not used, this pin must be set LOW or HIGH
on the board. It must not be left floating.
I/O
The I/O pin functions as an input, output, tristate, or
bidirectional buffer. Based on certain configurations, input
and output levels are compatible with standard TTL or
LVTTL specifications. Unused I/O pins are automatically
tristated by the Designer Series software.
Input/Output
NC
This pin is not connected to circuitry within the device.
These pins can be driven to any voltage or can be left
floating with no effect on the operation of the device.
No Connection
PRA, I/O,
PRB, I/O
The Probe pin is used to output data from any user-defined
design node within the device. This independent diagnostic
pin can be used in conjunction with the other probe pin to
allow real-time diagnostic output of any signal path within
the device. The Probe pin can be used as a user-defined I/O
when verification has been completed. The pin
s probe
capabilities can be permanently disabled to protect
programmed design confidentiality.
Probe A/B
TCK, I/O
Test clock input for diagnostic probe and device
programming. In flexible mode, TCK becomes active when
the TMS pin is set LOW (see
Table 2 on page 9
). This pin
functions as an I/O when the JTAG state machine reaches
the
logic reset
state.
Test Clock (Input)
TDI, I/O
Serial input for boundary scan testing and diagnostic probe.
In flexible mode, TDI is active when the TMS pin is set LOW
(refer to
Table 2 on page 9
). This pin functions as an I/O
when the boundary scan state machine reaches the
logic
reset
state.
Test Data Input
TDO, I/O
Serial output for boundary scan testing. In flexible mode,
TDO is active when the TMS pin is set LOW (refer to
Table 2
on page 9
). This pin functions as an I/O when the boundary
scan state machine reaches the
logic reset
state.
Test Data Output
TMS
The TMS pin controls the use of the IEEE 1149.1 Boundary
Scan pins (TCK, TDI, TDO, TRST). In flexible mode when
the TMS pin is set LOW, the TCK, TDI, and TDO pins are
boundary scan pins (refer to
Table 2 on page 9
). Once the
boundary scan pins are in test mode, they will remain in that
mode until the internal boundary scan state machine
reaches the
logic reset
state. At this point, the boundary
scan pins will be released and will function as regular I/O
pins. The
logic reset
state is reached 5 TCK cycles after
the TMS pin is set HIGH. In dedicated test mode, TMS
functions as specified in the IEEE 1149.1 specifications.
Test Mode Select
TRST
The TRST pin functions as an active-low input to
asynchronously initialize or reset the boundary scan circuit.
The TRST pin is equipped with an internal pull-up resistor.
Boundary Scan Reset Pin
V
CCI
Supply voltage for I/Os. See
Table 1 on page 8
.
Supply Voltage
V
CCA
Supply voltage for Array. See
Table 1 on page 8
.
Supply Voltage
V
CCR
Supply voltage for input tolerance (required for internal
biasing). See
Table 1 on page 8
.
Supply Voltage
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