Table 2-19 A54SX08A Timing Characteristics (Worst-Case Commercial Conditions V
參數(shù)資料
型號(hào): A54SX32A-FG256
廠商: Microsemi SoC
文件頁(yè)數(shù): 48/108頁(yè)
文件大?。?/td> 0K
描述: IC FPGA SX 48K GATES 256-FBGA
標(biāo)準(zhǔn)包裝: 90
系列: SX-A
LAB/CLB數(shù): 2880
輸入/輸出數(shù): 203
門數(shù): 48000
電源電壓: 2.25 V ~ 5.25 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 70°C
封裝/外殼: 256-LBGA
供應(yīng)商設(shè)備封裝: 256-FPBGA(17x17)
SX-A Family FPGAs
2- 24
v5.3
Table 2-19 A54SX08A Timing Characteristics
(Worst-Case Commercial Conditions VCCA = 2.25 V, VCCI = 3.0 V, TJ = 70°C)
Parameter
Description
–2 Speed
–1 Speed
Std. Speed
–F Speed
Units
Min.
Max.
Min.
Max.
Min.
Max.
Min.
Max.
3.3 V PCI Output Module Timing1
tDLH
Data-to-Pad Low to High
2.2
2.4
2.9
4.0
ns
tDHL
Data-to-Pad High to Low
2.3
2.6
3.1
4.3
ns
tENZL
Enable-to-Pad, Z to L
1.7
1.9
2.2
3.1
ns
tENZH
Enable-to-Pad, Z to H
2.2
2.4
2.9
4.0
ns
tENLZ
Enable-to-Pad, L to Z
2.8
3.2
3.8
5.3
ns
tENHZ
Enable-to-Pad, H to Z
2.3
2.6
3.1
4.3
ns
dTLH
2
Delta Low to High
0.03
0.04
0.045
ns/pF
dTHL
2
Delta High to Low
0.015
0.025
ns/pF
3.3 V LVTTL Output Module Timing3
tDLH
Data-to-Pad Low to High
3.0
3.4
4.0
5.6
ns
tDHL
Data-to-Pad High to Low
3.0
3.3
3.9
5.5
ns
tDHLS
Data-to-Pad High to Low—low slew
10.4
11.8
13.8
19.3
ns
tENZL
Enable-to-Pad, Z to L
2.6
2.9
3.4
4.8
ns
tENZLS
Enable-to-Pad, Z to L—low slew
18.9
21.3
25.4
34.9
ns
tENZH
Enable-to-Pad, Z to H
3
3.4
4
5.6
ns
tENLZ
Enable-to-Pad, L to Z
3.3
3.7
4.4
6.2
ns
tENHZ
Enable-to-Pad, H to Z
3
3.3
3.9
5.5
ns
dTLH
2
Delta Low to High
0.03
0.04
0.045
ns/pF
dTHL
2
Delta High to Low
0.015
0.025
ns/pF
dTHLS
2
Delta High to Low—low slew
0.053
0.067
0.073
0.107
ns/pF
Notes:
1. Delays based on 10 pF loading and 25
Ω resistance.
2. To obtain the slew rate, substitute the appropriate Delta value, load capacitance, and the VCCI value into the following equation:
Slew Rate [V/ns] = (0.1*VCCI – 0.9*VCCI)/ (Cload * dT[LH|HL|HLS])
where Cload is the load capacitance driven by the I/O in pF
dT[LH|HL|HLS] is the worst case delta value from the datasheet in ns/pF.
3. Delays based on 35 pF loading.
相關(guān)PDF資料
PDF描述
APA150-PQG208I IC FPGA PROASIC+ 150K 208-PQFP
APA150-PQ208I IC FPGA PROASIC+ 150K 208-PQFP
AMC30DRTN-S93 CONN EDGECARD 60POS DIP .100 SLD
ACC44DRTN-S93 CONN EDGECARD 88POS DIP .100 SLD
AMC30DRTH-S93 CONN EDGECARD 60POS DIP .100 SLD
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
A54SX32A-FG256A 功能描述:IC FPGA SX 48K GATES 256-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:SX-A 標(biāo)準(zhǔn)包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計(jì):- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FPBGA(27X27)
A54SX32A-FG256I 功能描述:IC FPGA SX 48K GATES 256-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:SX-A 標(biāo)準(zhǔn)包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計(jì):- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FPBGA(27X27)
A54SX32A-FG256M 制造商:Microsemi Corporation 功能描述:FPGA SX-A 32K GATES 1800 CELLS 238MHZ 0.25UM/0.22UM 2.5V 256 - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA 48K GATES 256FBGA 制造商:Microsemi Corporation 功能描述:IC FPGA 203 I/O 256FBGA
A54SX32A-FG484 功能描述:IC FPGA SX 48K GATES 484-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:SX-A 標(biāo)準(zhǔn)包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計(jì):- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FPBGA(27X27)
A54SX32A-FG484I 功能描述:IC FPGA SX 48K GATES 484-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:SX-A 產(chǎn)品培訓(xùn)模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標(biāo)準(zhǔn)包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計(jì):6635520 輸入/輸出數(shù):270 門數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FBGA(23x23)