Table 2-36 A54SX72A Timing Characteristics (Worst-Case Commercial Conditions V
參數(shù)資料
型號: A54SX32A-FG256
廠商: Microsemi SoC
文件頁數(shù): 70/108頁
文件大?。?/td> 0K
描述: IC FPGA SX 48K GATES 256-FBGA
標(biāo)準(zhǔn)包裝: 90
系列: SX-A
LAB/CLB數(shù): 2880
輸入/輸出數(shù): 203
門數(shù): 48000
電源電壓: 2.25 V ~ 5.25 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 70°C
封裝/外殼: 256-LBGA
供應(yīng)商設(shè)備封裝: 256-FPBGA(17x17)
SX-A Family FPGAs
2- 44
v5.3
Table 2-36 A54SX72A Timing Characteristics
(Worst-Case Commercial Conditions VCCA = 2.25 V, VCCI = 2.25 V, TJ = 70°C)
Parameter
Description
–3 Speed*
–2 Speed
–1 Speed
Std. Speed
–F Speed
Units
Min. Max. Min. Max. Min. Max. Min. Max. Min. Max.
Dedicated (Hardwired) Array Clock Networks
tHCKH
Input Low to High
(Pad to R-cell Input)
1.6
1.9
2.1
2.5
3.8
ns
tHCKL
Input High to Low
(Pad to R-cell Input)
1.6
1.9
2.1
2.5
3.8
ns
tHPWH
Minimum Pulse Width High
1.5
1.7
2.0
2.3
3.2
ns
tHPWL
Minimum Pulse Width Low
1.5
1.7
2.0
2.3
3.2
ns
tHCKSW
Maximum Skew
1.4
1.6
1.8
2.1
3.3
ns
tHP
Minimum Period
3.0
3.4
4.0
4.6
6.4
ns
fHMAX
Maximum Frequency
333
294
250
217
156
MHz
Routed Array Clock Networks
tRCKH
Input Low to High (Light Load)
(Pad to R-cell Input)
2.3
2.6
2.9
3.4
4.8
ns
tRCKL
Input High to Low (Light Load)
(Pad to R-cell Input)
2.8
3.2
3.7
4.3
6.0
ns
tRCKH
Input Low to High (50% Load)
(Pad to R-cell Input)
2.4
2.8
3.2
3.7
5.2
ns
tRCKL
Input High to Low (50% Load)
(Pad to R-cell Input)
2.9
3.3
3.8
4.5
6.2
ns
tRCKH
Input Low to High (100% Load)
(Pad to R-cell Input)
2.6
3.0
3.4
4.0
5.6
ns
tRCKL
Input High to Low (100% Load)
(Pad to R-cell Input)
3.1
3.6
4.0
4.7
6.6
ns
tRPWH
Minimum Pulse Width High
1.5
1.7
2.0
2.3
3.2
ns
tRPWL
Minimum Pulse Width Low
1.5
1.7
2.0
2.3
3.2
ns
tRCKSW
Maximum Skew (Light Load)
1.9
2.2
2.5
3.0
4.1
ns
tRCKSW
Maximum Skew (50% Load)
1.8
2.1
2.4
2.8
3.9
ns
tRCKSW
Maximum Skew (100% Load)
1.8
2.1
2.4
2.8
3.9
ns
Quadrant Array Clock Networks
tQCKH
Input Low to High (Light Load)
(Pad to R-cell Input)
2.6
3.0
3.4
4.0
5.6
ns
tQCHKL
Input High to Low (Light Load)
(Pad to R-cell Input)
2.6
3.0
3.3
3.9
5.5
ns
tQCKH
Input Low to High (50% Load)
(Pad to R-cell Input)
2.8
3.2
3.6
4.3
6.0
ns
tQCHKL
Input High to Low (50% Load)
(Pad to R-cell Input)
2.8
3.2
3.6
4.2
5.9
ns
Note: *All –3 speed grades have been discontinued.
相關(guān)PDF資料
PDF描述
APA150-PQG208I IC FPGA PROASIC+ 150K 208-PQFP
APA150-PQ208I IC FPGA PROASIC+ 150K 208-PQFP
AMC30DRTN-S93 CONN EDGECARD 60POS DIP .100 SLD
ACC44DRTN-S93 CONN EDGECARD 88POS DIP .100 SLD
AMC30DRTH-S93 CONN EDGECARD 60POS DIP .100 SLD
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
A54SX32A-FG256A 功能描述:IC FPGA SX 48K GATES 256-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:SX-A 標(biāo)準(zhǔn)包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計:- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FPBGA(27X27)
A54SX32A-FG256I 功能描述:IC FPGA SX 48K GATES 256-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:SX-A 標(biāo)準(zhǔn)包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計:- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FPBGA(27X27)
A54SX32A-FG256M 制造商:Microsemi Corporation 功能描述:FPGA SX-A 32K GATES 1800 CELLS 238MHZ 0.25UM/0.22UM 2.5V 256 - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA 48K GATES 256FBGA 制造商:Microsemi Corporation 功能描述:IC FPGA 203 I/O 256FBGA
A54SX32A-FG484 功能描述:IC FPGA SX 48K GATES 484-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:SX-A 標(biāo)準(zhǔn)包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計:- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FPBGA(27X27)
A54SX32A-FG484I 功能描述:IC FPGA SX 48K GATES 484-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:SX-A 產(chǎn)品培訓(xùn)模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標(biāo)準(zhǔn)包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計:6635520 輸入/輸出數(shù):270 門數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FBGA(23x23)