參數(shù)資料
型號: AD5204BRZ50-REEL
廠商: Analog Devices Inc
文件頁數(shù): 10/20頁
文件大?。?/td> 0K
描述: IC DGTL POT QUAD 50K 24-SOIC
標(biāo)準(zhǔn)包裝: 1,000
接片: 256
電阻(歐姆): 50k
電路數(shù): 4
溫度系數(shù): 標(biāo)準(zhǔn)值 700 ppm/°C
存儲(chǔ)器類型: 易失
接口: 4 線 SPI(芯片選擇)
電源電壓: 2.7 V ~ 5.5 V,±2.3 V ~ 2.7 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 24-SOIC(0.295",7.50mm 寬)
供應(yīng)商設(shè)備封裝: 24-SOIC W
包裝: 帶卷 (TR)
AD5204/AD5206
Rev. C | Page 18 of 20
24
13
12
1
6.40 BSC
4.50
4.40
4.30
PIN 1
7.90
7.80
7.70
0.15
0.05
0.30
0.19
0.65
BSC
1.20
MAX
0.20
0.09
0.75
0.60
0.45
SEATING
PLANE
0.10 COPLANARITY
COMPLIANT TO JEDEC STANDARDS MO-153-AD
Figure 37. 24-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-24)
Dimensions shown in millimeters
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
0.30
0.23
0.18
0.20 REF
0.80 MAX
0.65 TYP
0.05 MAX
0.02 NOM
12° MAX
1.00
0.85
0.80
SEATING
PLANE
COPLANARITY
0.08
1
32
8
9
25
24
16
17
0.50
0.40
0.30
3.50 REF
0.50
BSC
PIN 1
INDICATOR
TOP
VIEW
5.00
BSC SQ
4.75
BSC SQ
3.45
3.30 SQ
3.15
PIN 1
INDICATOR
0.60 MAX
0.25 MIN
EXPOSED
PAD
(BOTTOM VIEW)
11
24
08
-A
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 38. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
5 mm × 5 mm Body, Very Thin Quad
(CP-32-3)
Dimensions shown in millimeters
ORDERING GUIDE
Temperature Range
Package Description
Package Option
AD5204BN10
10
40°C to +85°C
24-Lead Plastic Dual In-Line Package [PDIP]
N-24-1
AD5204BR10
10
40°C to +85°C
24-Lead Standard Small Outline Package [SOIC_W]
RW-24
AD5204BR10-REEL
10
40°C to +85°C
24-Lead Standard Small Outline Package [SOIC_W]
RW-24
AD5204BRZ10
10
40°C to +85°C
24-Lead Standard Small Outline Package [SOIC_W]
RW-24
AD5204BRZ10-REEL
10
40°C to +85°C
24-Lead Standard Small Outline Package [SOIC_W]
RW-24
AD5204BRU10
10
40°C to +85°C
24-Lead Thin Shrink Small Outline Package [TSSOP]
RU-24
AD5204BRU10-REEL7
10
40°C to +85°C
24-Lead Thin Shrink Small Outline Package [TSSOP]
RU-24
AD5204BRUZ10
10
40°C to +85°C
24-Lead Thin Shrink Small Outline Package [TSSOP]
RU-24
AD5204BRUZ10-REEL7
10
40°C to +85°C
24-Lead Thin Shrink Small Outline Package [TSSOP]
RU-24
AD5204BCPZ10-REEL
10
40°C to +85°C
32-Lead Frame Chip Scale Package [LFCSP_VQ]
CP-32-3
AD5204BCPZ10-REEL7
10
40°C to +85°C
32-Lead Frame Chip Scale Package [LFCSP_VQ]
CP-32-3
AD5204BN50
50
40°C to +85°C
24-Lead Plastic Dual In-Line Package [PDIP]
N-24-1
AD5204BR50
50
40°C to +85°C
24-Lead Standard Small Outline Package [SOIC_W]
RW-24
AD5204BR50-REEL
50
40°C to +85°C
24-Lead Standard Small Outline Package [SOIC_W]
RW-24
AD5204BRZ50
50
40°C to +85°C
24-Lead Standard Small Outline Package [SOIC_W]
RW-24
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