參數(shù)資料
型號(hào)： AD5235BRU25-RL7
廠商： Analog Devices Inc
文件頁(yè)數(shù)： 23/32頁(yè)
文件大?。?/td> 0K
描述： IC DGTL POT DUAL 1024POS 16TSSOP
標(biāo)準(zhǔn)包裝： 1
接片： 1024
電阻（歐姆）： 25k
電路數(shù)： 2
溫度系數(shù)： 標(biāo)準(zhǔn)值 35 ppm/°C
存儲(chǔ)器類型： 非易失
接口： 4 線 SPI（芯片選擇）
電源電壓： 3 V ~ 5.5 V，±2.25 V ~ 2.75 V
工作溫度： -40°C ~ 85°C
安裝類型： 表面貼裝
封裝/外殼： 16-TSSOP（0.173"，4.40mm 寬）
供應(yīng)商設(shè)備封裝： 16-TSSOP
包裝： 標(biāo)準(zhǔn)包裝
其它名稱： AD5235BRU25-RL7DKR
Data Sheet
AD5235
Rev. F | Page 3 of 32
REVISION HISTORY
6/12—Rev. E to Rev. F
Changes to Table 1 Conditions........................................................4
Removed Positive Supply Current RDY and/or SDO Floating
Parameters and Negative Supply Current RDY and/or SDO
Floating Parameters, Table 1............................................................5
Added Endnote 2 to Ordering Guide...........................................30
4/11—Rev. D to Rev. E
Changes to Figure 12 ......................................................................11
4/11—Rev. C to Rev. D
Changes to EEMEM Performance.............................. Throughout
Changes to Features and General Descriptions Sections.............1
Changes to Specifications Section...................................................4
Changes to Pin 5, Pin 13, Pin 14 Descriptions..............................9
Changes to Typical Performance Characteristics Section .........10
Changes to Table 7 ..........................................................................19
Changes to Table 9 ..........................................................................21
Changes to Rheostat Operation Section, Table 12, Table 13 .....22
Changes to Table 16, Table 19, and EVAL-AD5235SDZ
Evaluation Kit Section ....................................................................23
Changes to RDAC Circuit Simulation Model Section ...............29
Updated Outline Dimensions........................................................30
Changes to Ordering Guide...........................................................30
4/09—Rev. B to Rev. C
Changes to Figure 1...........................................................................1
Changes to Specifications.................................................................3
Changes to SDO, Description Column, Table 4............................8
Changes to Figure 18 ......................................................................11
Changes to Theory of Operation Section ....................................14
Changes to Serial Data Interface Section.....................................15
Changes to Linear Increment and Decrement Instructions
Section, Logarithmic Taper Mode Adjustment Section, and
Figure 42...........................................................................................18
Changes to Rheostat Operations Section.....................................20
Changes to Bipolar Programmable Gain Amplifier Section,
Figure 49, Table 21, and 10-Bit Bipolar DAC Section ................23
Changes to Programmable Oscillator Section and Figure 56 ...25
Changes to Ordering Guide...........................................................28
7/04—Rev. A to Rev. B
Updated Formatting .......................................................... Universal
Edits to Features, General Description, and Block Diagram ......1
Changes to Specifications.................................................................3
Replaced Timing Diagrams .............................................................6
Changes to Absolute Maximum Ratings........................................7
Changes to Pin Function Descriptions ..........................................8
Changes to Typical Performance Characteristics .........................9
Additional Test Circuit (Figure 36).................................................9
Edits to Theory of Operation ........................................................14
Edits to Applications.......................................................................23
Updated Outline Dimensions........................................................27
8/02—Rev. 0 to Rev. A
Change to Features and General Description ...............................1
Change to Specifications ..................................................................2
Change to Calculating Actual End-to-End Terminal
Resistance Section...........................................................................14
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