參數(shù)資料
型號: AD7701AR
廠商: Analog Devices Inc
文件頁數(shù): 9/20頁
文件大小: 0K
描述: IC ADC 16BIT LC2MOS 20-SOIC
標(biāo)準(zhǔn)包裝: 1
位數(shù): 16
采樣率(每秒): 4k
數(shù)據(jù)接口: 串行
轉(zhuǎn)換器數(shù)目: 1
功率耗散(最大): 37mW
電壓電源: 模擬和數(shù)字,雙 ±
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 20-SOIC(0.295",7.50mm 寬)
供應(yīng)商設(shè)備封裝: 20-SOIC W
包裝: 管件
輸入數(shù)目和類型: 1 個單端,單極;1 個單端,雙極
REV. E
AD7701
–17–
OUTLINE DIMENSIONS
20-Lead Plastic Dual In-Line Package [PDIP]
(N-20)
Dimensions shown in inches and (millimeters)
20
1
10
11
0.985 (25.02)
0.965 (24.51)
0.945 (24.00)
0.295 (7.49)
0.285 (7.24)
0.275 (6.99)
0.150 (3.81)
0.135 (3.43)
0.120 (3.05)
0.015 (0.38)
0.010 (0.25)
0.008 (0.20)
0.325 (8.26)
0.310 (7.87)
0.300 (7.62)
SEATING
PLANE
0.015 (0.38) MIN
0.180 (4.57)
MAX
0.022 (0.56)
0.018 (0.46)
0.014 (0.36)
0.150 (3.81)
0.130 (3.30)
0.110 (2.79)
0.100
(2.54)
BSC
0.060 (1.52)
0.050 (1.27)
0.045 (1.14)
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
COMPLIANT TO JEDEC STANDARDS MO-095-AE
20-Lead Standard Small Outline Package [SOIC]
Wide Body
(R-20)
Dimensions shown in millimeters and (inches)
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
COMPLIANT TO JEDEC STANDARDS MS-013AC
0.75 (0.0295)
0.25 (0.0098)
20
11
10
1
0.32 (0.0126)
0.23 (0.0091)
8
0
45
1.27 (0.0500)
0.40 (0.0157)
SEATING
PLANE
0.30 (0.0118)
0.10 (0.0039)
0.51 (0.0201)
0.33 (0.0130)
2.65 (0.1043)
2.35 (0.0925)
1.27
(0.0500)
BSC
10.65 (0.4193)
10.00 (0.3937)
7.60 (0.2992)
7.40 (0.2913)
13.00 (0.5118)
12.60 (0.4961)
COPLANARITY
0.10
20-Lead Ceramic Dual In-Line Pacakage [CERDIP]
(Q-20)
Dimensions shown in inches and (millimeters)
20
110
11
0.310 (7.87)
0.220 (5.59)
PIN 1
0.005
(0.13)
MIN
0.098 (2.49)
MAX
15
0
0.320 (8.13)
0.290 (7.37)
0.015 (0.38)
0.008 (0.20)
SEATING
PLANE
0.200 (5.08)
MAX
1.060 (26.92) MAX
0.150 (3.81)
MIN
0.200 (5.08)
0.125 (3.18)
0.023 (0.58)
0.014 (0.36)
0.100
(2.54)
BSC
0.070 (1.78)
0.030 (0.76)
0.060 (1.52)
0.015 (0.38)
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETERS DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
28-Lead Shrink Small Outline Package [SSOP]
(RS-28)
Dimensions shown in millimeters
0.25
0.09
0.95
0.75
0.55
8
4
0
0.05
MIN
1.85
1.75
1.65
2.00 MAX
0.38
0.22
SEATING
PLANE
0.65
BSC
0.10
COPLANARITY
28
15
14
1
10.50
10.20
9.90
5.60
5.30
5.00
8.20
7.80
7.40
COMPLIANT TO JEDEC STANDARDS MO-150AH
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