AD7707
Rev. B | Page 9 of 52
ABSOLUTE MAXIMUM RATINGS
TA = +25°C, unless otherwise noted.
Table 5.
Parameter
Rating
AVDD to AGND
0.3 V to +7 V
AVDD to DGND
0.3 V to +7 V
DVDD to AGND
0.3 V to +7 V
DVDD to DGND
0.3 V to +7 V
AVDD to DVDD
0.3 V to +7 V
DGND to AGND
0.3 V to +0.3 V
AIN1, AIN2 Input Voltage to LOCOM
0.3 V to AVDD + 0.3 V
AIN3 Input Voltage to HICOM
11 V to +30 V
VBIAS to AGND
0.3 V to AVDD + 0.3 V
HICOM, LOCOM to AGND
0.3 V to AVDD + 0.3 V
REF IN(+), REF IN() to AGND
0.3 V to AVDD + 0.3 V
Digital Input Voltage to DGND
0.3 V to DVDD + 0.3 V
Digital Output Voltage to DGND
0.3 V to DVDD + 0.3 V
Operating Temperature Range
Industrial (B Version)
40°C to +85°C
Storage Temperature Range
65°C to +150°C
Junction Temperature
150°C
SOIC Package, Power Dissipation
450 mW
θJA Thermal Impedance
75°C/W
Lead Temperature, Soldering
Reflow
260°C
TSSOP Package, Power Dissipation
450 mW
θJA Thermal Impedance
139°C/W
Lead Temperature, Soldering
Reflow
260°C
ESD Rating
2.5 kV
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION